Nexperia, Toshiba, and Infineon have designed MOSFETs that offer different strategies in advancing high-power design.
Nexperia, Toshiba, and Infineon have designed MOSFETs that offer different strategies in advancing high-power design.
From power modules and reference designs to GaN bus converters, Texas Instruments’ new solutions address data…
From power modules and reference designs to GaN bus converters, Texas Instruments’ new solutions address data centers’ growing power usage.
The 100 V MOSFETs in compact CCPAK1212 packaging cut conduction losses, save space, and boost performance in 48 V…
The 100 V MOSFETs in compact CCPAK1212 packaging cut conduction losses, save space, and boost performance in 48 V automotive applications.
Infineon, Toshiba, and Rohm’s product releases and proven applications indicate continued growth in the high-power…
Infineon, Toshiba, and Rohm’s product releases and proven applications indicate continued growth in the high-power MOSFET market.
Wise Integration, Eaton, Xendee, LatWind, Nuclearn, Conflux, and Honeywell are strategically addressing changes in the…
Wise Integration, Eaton, Xendee, LatWind, Nuclearn, Conflux, and Honeywell are strategically addressing changes in the energy landscape.
Power Integrations has launched a reference design kit integrating its high-efficiency PowiGaN-based InnoSwitch3-AQ IC…
Power Integrations has launched a reference design kit integrating its high-efficiency PowiGaN-based InnoSwitch3-AQ IC for lightweight, thermally…
The CoolSiC G2 MOSFET variants expand cooling options and compact form factors to medium-power SMPS designs.
The CoolSiC G2 MOSFET variants expand cooling options and compact form factors to medium-power SMPS designs.
The 1200 V CoolSiC G2 MOSFETs deliver higher power density, lower losses, and improved thermal performance for industrial systems.
The 1200 V CoolSiC G2 MOSFETs deliver higher power density, lower losses, and improved thermal performance for industrial systems.
Nexperia’s MJPE-series BJTs in CFP15B format offer smaller footprints and strong thermal performance for automotive and…
Nexperia’s MJPE-series BJTs in CFP15B format offer smaller footprints and strong thermal performance for automotive and industrial designs.
The embedding of semiconductor dies, particularly GaN and SiC MOSFETs, into PCB structures provides multiple system-level…
The embedding of semiconductor dies, particularly GaN and SiC MOSFETs, into PCB structures provides multiple system-level benefits. Learn how this…
Iontra’s charge control MCU chips offer an innovative solution to improve battery charging performance, leading to…
Iontra’s charge control MCU chips offer an innovative solution to improve battery charging performance, leading to faster and safer charging and…
Electric vehicle motor architecture is evolving rapidly, with axial-flux, dual-rotor, and magnet-free designs advancing…
Electric vehicle motor architecture is evolving rapidly, with axial-flux, dual-rotor, and magnet-free designs advancing efficiency and integration.
TDK, Littelfuse, and Novosense have released components targeting scalability, thermal resilience, and EMI issues.
TDK, Littelfuse, and Novosense have released components targeting scalability, thermal resilience, and EMI issues.
Today’s on-board chargers (OBCs) can benefit from lighter and more efficient electronic components. Learn how compact…
Today’s on-board chargers (OBCs) can benefit from lighter and more efficient electronic components. Learn how compact transfer molded power…
The latest devices from Microchip, Rohm, and Semi-Q offer enhanced radiation protection, increased operation range, lower…
The latest devices from Microchip, Rohm, and Semi-Q offer enhanced radiation protection, increased operation range, lower conduction losses, and…
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
Hyundai Mobis brings a new line of defense against thermal runaway in electric vehicle batteries.
Hyundai Mobis brings a new line of defense against thermal runaway in electric vehicle batteries.
SiC-based semiconductors can operate higher temperatures than silicon-based devices. Learn the unique challenges involved…
SiC-based semiconductors can operate higher temperatures than silicon-based devices. Learn the unique challenges involved with monitoring and…
XING and PEWC have married two battery technologies to provide greater performance and flexibility for AI data center power needs.
XING and PEWC have married two battery technologies to provide greater performance and flexibility for AI data center power needs.
A deep learning model proved more accurate than other methods in predicting thermal runaway in lithium-ion batteries.
A deep learning model proved more accurate than other methods in predicting thermal runaway in lithium-ion batteries.
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