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Developing Embedded Controls using PLECSPIL

Developing Embedded Controls using PLECSPIL

This article presents a methodology and product to help embedded controls engineers develop and test sophisticated real-time power conversion…


DeRisking the Route to Silicon Carbide

DeRisking the Route to Silicon Carbide

This article highlights Raytheon UK’s Semiconductor Business Unit with high-temperature SiC (HiTSiC) technology for an advanced SiC manufacturing…


Wireless Power Transmission with High Efficiency and Wide Dynamic Range for Extensive Applications

Wireless Power Transmission with High Efficiency and Wide Dynamic Range for Extensive Applications

This article introduces the concept of transmitting power over wireless link with accordance to uniWP that allows multiple new applications and…


Digital Power Comes of Age

Digital Power Comes of Age

This article describes the factors that have driven the evolution of distributed power architectures of HF DC-DC converter modules and offers…


Where is the Journey Headed? The Future of High-Power Semiconductors

Where is the Journey Headed? The Future of High-Power Semiconductors

This article discusses the future of high-power semiconductors in power electronics systems technology of energy savings, dynamics and noise…


Thermal Efficiency of Chipscale Packaging for eGaN® FETs

Thermal Efficiency of Chipscale Packaging for eGaN® FETs

This article discusses the thermal performance of the chipscale package and compare with the state-of-the-art power MOSFET packaging available today.