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STMicroelectronics Begins Producing 200mm Silicon Carbide Wafers

STMicroelectronics Begins Producing 200mm Silicon Carbide Wafers

The effort marks ST’s commitment to the high power, high voltage requirements of the automotive and industrial markets.


Bourns Expands Line of 1210-Size Automotive Grade Common Mode Chip Inductors

Bourns Expands Line of 1210-Size Automotive Grade Common Mode Chip Inductors

New compact and rugged inductors feature low radiation and high impedance over a broad frequency range delivering excellent EMI suppression.


GaN Systems and onsemi Partner on Bridgeless Totem Pole PFC Evaluation Board

GaN Systems and onsemi Partner on Bridgeless Totem Pole PFC Evaluation Board

Companies Introduce World’s First Bridgeless Totem Pole PFC Evaluation Board.


Rad Hard Gallium Nitride (GaN) Power Devices from EPC Space Selected by Astranis for Geostationary Satellites

Rad Hard Gallium Nitride (GaN) Power Devices from EPC Space Selected by Astranis for Geostationary Satellites

EPC Space is providing Rad Hard GaN power devices to Astranis for use in the latest build of new small geostationary communications satellites.


UnitedSiC Launches FET-Jet Calculator v2

UnitedSiC Launches FET-Jet Calculator v2

Enhancements to the online power design tool make identifying optimal SiC FET design solutions even easier.


Silanna Semiconductor Debuts an ACF Controller Supporting Power Adapters up to 100W

Silanna Semiconductor Debuts an ACF Controller Supporting Power Adapters up to 100W

The new active clamp flyback (ACF) controller operates over input ranges of 90 to 165VAC and enables efficiencies of up to 95%


Texas Instruments Partners With B-Secur For ECGEKG Monitoring IC

Texas Instruments Partners With B-Secur For ECGEKG Monitoring IC

TI’s IC can achieve low current on continuous operation making it ideal for optical heart monitoring.


Silicon capacitor supports new power distribution networks performance requirements

Silicon capacitor supports new power distribution networks performance requirements

Murata high-density silicon capacitors are developed with a semiconductor MOS process and are using the third dimension to substantially increase…


Intel Looks to Improve Backside Power Delivery with new RibbonFET and PowerVia Architectures

Intel Looks to Improve Backside Power Delivery with new RibbonFET and PowerVia Architectures

Intel announced the company's future process and packaging technology roadmaps at its "Accelerated" webcast last week.


Nexperia’s ASFETs for Hot-swap Increase SOA by 166% and Cut PCB Footprint by 80%

Nexperia’s ASFETs for Hot-swap Increase SOA by 166% and Cut PCB Footprint by 80%

New 80V & 100V devices minimize derating and improve current sharing for optimum performance, high reliability, and reduced system cost.


Orchard Audio Launches a 500W Stereo GaN Streaming Hi-Fi Audio Amplifier

Orchard Audio Launches a 500W Stereo GaN Streaming Hi-Fi Audio Amplifier

The Starkrimson Streamer Ultra represents a new kind of high-end audio system that offers commanding performance in a discreet package. It can…


ROHM Debuts Three IGBTs with Built-In SiC Schottky Barrier Diodes (SBD)

ROHM Debuts Three IGBTs with Built-In SiC Schottky Barrier Diodes (SBD)

The new devices utilize ROHM’s Schottky SBDs as a freewheeling diode to effect minimal switching power losses


EPC Space Announces Cost Effective New 60V Rad Hard GaN Power Device for Demanding Space Applications

EPC Space Announces Cost Effective New 60V Rad Hard GaN Power Device for Demanding Space Applications

EPC Space introduces a new 60 V radiation-hardened (rad-hard) gallium nitride (GaN) transistor for power conversion solutions in critical…


Extremely Compact Single-chip PMIC Solution From Nordice Semiconductor at Rutronik

Extremely Compact Single-chip PMIC Solution From Nordice Semiconductor at Rutronik

The unit features thermal battery protection and automatic selection of three charging modes: automatic trickle charge, constant current, and…


Microchip Expands SiC Portfolio with 1700V Solutions

Microchip Expands SiC Portfolio with 1700V Solutions

Today’s energy-efficient electric charging systems powering commercial vehicle propulsion, as well as auxiliary power systems, solar inverters,…


Fraunhofer IAF Establishes a GaN Low Voltage IC Design for 3-Phase Motor Inverters

Fraunhofer IAF Establishes a GaN Low Voltage IC Design for 3-Phase Motor Inverters

The Fraunhofer Institute for Applied Solid State Physics (IAF), explored new research through their latest ideas for integrating GaN-based ICs for…


Tagore Introduces 650V GaN Power IC, Comprising GaN Power FET with Monolithically Integrated Driver

Tagore Introduces 650V GaN Power IC, Comprising GaN Power FET with Monolithically Integrated Driver

Tagore Technology announces the introduction of the TP44200NM 650V Gallium Nitride Power FET with an integrated driver IC in a compact 22 pin, 5mm…


Taiwan Semiconductor Debuts Two Families of Fast Recovery Epitaxial Diodes

Taiwan Semiconductor Debuts Two Families of Fast Recovery Epitaxial Diodes

Micro SMA packaged, 25ns, max. reverse recovery time diodes are AEC-Q101 qualified; 1A- and 2A-rated parts feature low reverse leakage, low reverse…


Dialog Semiconductor Debuts ZVS Chipset for High Power Density PSUs

Dialog Semiconductor Debuts ZVS Chipset for High Power Density PSUs

The new chipset will enable power supply units (PSU) of 100+ watts that are 30-50% smaller than those now available.


Mersen Takes Liquid Cooling to the Extreme

Mersen Takes Liquid Cooling to the Extreme

High cooling capacity with minimal pressure drop is a convincing feature of the new IsoMAXX cold plates from Mersen.