The Gen-4 modules aim to increase current capability and extend e-mobility inverter lifetime.
The Gen-4 modules aim to increase current capability and extend e-mobility inverter lifetime.
Learn how two new Mitsubishi SLIMDIP IPMs address the growing need for high-efficiency power semiconductor devices in…
Learn how two new Mitsubishi SLIMDIP IPMs address the growing need for high-efficiency power semiconductor devices in consumer applications.
This article explores the benefits of SiC devices in selected use cases, including HVAC systems, DC fast charging…
This article explores the benefits of SiC devices in selected use cases, including HVAC systems, DC fast charging infrastructure, and solar and…
Sungrow, Easymetering, Qualcomm, Infineon, SolarEdge, ABB, VoltaGrid, and Southwest Power Pool have new projects in the works.
Sungrow, Easymetering, Qualcomm, Infineon, SolarEdge, ABB, VoltaGrid, and Southwest Power Pool have new projects in the works.
The driver integrates adjustable negative bias and reduces external components in automotive power systems.
The driver integrates adjustable negative bias and reduces external components in automotive power systems.
Nexperia, Toshiba, and Infineon have designed MOSFETs that offer different strategies in advancing high-power design.
Nexperia, Toshiba, and Infineon have designed MOSFETs that offer different strategies in advancing high-power design.
The new single-channel driver uses capacitive isolation to tighten control of Si/SiC MOSFETs and IGBTs in noisy power stages.
The new single-channel driver uses capacitive isolation to tighten control of Si/SiC MOSFETs and IGBTs in noisy power stages.
The design features wide bandgap semiconductors in a full-bridge LLC with planar magnetics.
The design features wide bandgap semiconductors in a full-bridge LLC with planar magnetics.
Rohm’s DOT-247 SiC module combines two devices in one package, raising power density and cutting board size for…
Rohm’s DOT-247 SiC module combines two devices in one package, raising power density and cutting board size for inverters, UPS, and EV systems.
National laboratories have discovered solutions for solid-state batteries, smart power modules, and grid cybersecurity.
National laboratories have discovered solutions for solid-state batteries, smart power modules, and grid cybersecurity.
Infineon, Toshiba, and Rohm’s product releases and proven applications indicate continued growth in the high-power…
Infineon, Toshiba, and Rohm’s product releases and proven applications indicate continued growth in the high-power MOSFET market.
The CoolSiC G2 MOSFET variants expand cooling options and compact form factors to medium-power SMPS designs.
The CoolSiC G2 MOSFET variants expand cooling options and compact form factors to medium-power SMPS designs.
Learn how Mitsubishi’s in-house designed & developed efficient semiconductor bare-dies (SiC MOSFET & Si RC-IGBT) and…
Learn how Mitsubishi’s in-house designed & developed efficient semiconductor bare-dies (SiC MOSFET & Si RC-IGBT) and compact…
Navitas, Toshiba, Porsche, ChargePoint, Richardson Electronics, and Landis+Gyr have made notable shifts in leaders,…
Navitas, Toshiba, Porsche, ChargePoint, Richardson Electronics, and Landis+Gyr have made notable shifts in leaders, strategies, partners, and…
The expanded series offers higher working voltages to 1000 V in smaller form factors.
The expanded series offers higher working voltages to 1000 V in smaller form factors.
The 1200 V CoolSiC G2 MOSFETs deliver higher power density, lower losses, and improved thermal performance for industrial systems.
The 1200 V CoolSiC G2 MOSFETs deliver higher power density, lower losses, and improved thermal performance for industrial systems.
Learn about Mitsubishi’s XB-Series HV-IGBT modules. They offer lower switching losses and enhanced reliability through…
Learn about Mitsubishi’s XB-Series HV-IGBT modules. They offer lower switching losses and enhanced reliability through 7th-gen Si IGBT and RFC…
Learn how SiC inverter solutions offer a modular, functionally safe platform with certified components, accelerating…
Learn how SiC inverter solutions offer a modular, functionally safe platform with certified components, accelerating development and compliance…
The embedding of semiconductor dies, particularly GaN and SiC MOSFETs, into PCB structures provides multiple system-level…
The embedding of semiconductor dies, particularly GaN and SiC MOSFETs, into PCB structures provides multiple system-level benefits. Learn how this…
Joint projects, acquisitions, and new leadership dominated recent business strategies in power grids, electric vehicles,…
Joint projects, acquisitions, and new leadership dominated recent business strategies in power grids, electric vehicles, SiC, and semiconductors.
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