Learn how SiC inverter solutions offer a modular, functionally safe platform with certified components, accelerating development and compliance…
Learn how SiC inverter solutions offer a modular, functionally safe platform with certified components, accelerating development and compliance…
The embedding of semiconductor dies, particularly GaN and SiC MOSFETs, into PCB structures provides multiple system-level…
The embedding of semiconductor dies, particularly GaN and SiC MOSFETs, into PCB structures provides multiple system-level benefits. Learn how this…
Joint projects, acquisitions, and new leadership dominated recent business strategies in power grids, electric vehicles,…
Joint projects, acquisitions, and new leadership dominated recent business strategies in power grids, electric vehicles, SiC, and semiconductors.
SiC trench gate MOSFETs deliver superior performance in terms of both switching and conduction losses, but careful…
SiC trench gate MOSFETs deliver superior performance in terms of both switching and conduction losses, but careful attention must be paid to the…
Littelfuse, Nexperia, and Vishay have released diode products that provide designers with upgraded features.
Littelfuse, Nexperia, and Vishay have released diode products that provide designers with upgraded features.
The new SiC-LV100 SiC-MOSFET module features an optimized structure that tackles the challenges of high current density…
The new SiC-LV100 SiC-MOSFET module features an optimized structure that tackles the challenges of high current density and high-speed switching.
The FLXPro Series offers a digitally configurable AC-DC power supply with high power density and modular outputs.
The FLXPro Series offers a digitally configurable AC-DC power supply with high power density and modular outputs.
Toshiba’s new device structures aim to boost efficiency and reliability in high-temperature power conversion systems.
Toshiba’s new device structures aim to boost efficiency and reliability in high-temperature power conversion systems.
The companies will develop an entirely novel power architecture for future AI data centers.
The companies will develop an entirely novel power architecture for future AI data centers.
The MOSFETs feature numerous structural and material innovations in a DFN 8x8 package.
The MOSFETs feature numerous structural and material innovations in a DFN 8x8 package.
Silicon Carbide (SiC) has a 3x bandgap compared to silicon. Learn how unipolar devices like MOSETs in the several kV…
Silicon Carbide (SiC) has a 3x bandgap compared to silicon. Learn how unipolar devices like MOSETs in the several kV range are possible with SiC.
The company has launched five reference designs with its InnoSwitch3-AQ flyback ICs, targeting inverter power, battery…
The company has launched five reference designs with its InnoSwitch3-AQ flyback ICs, targeting inverter power, battery replacement, and emergency…
The latest devices from Microchip, Rohm, and Semi-Q offer enhanced radiation protection, increased operation range, lower…
The latest devices from Microchip, Rohm, and Semi-Q offer enhanced radiation protection, increased operation range, lower conduction losses, and…
PCIM 2025 featured advancements in SiC and GaN devices, power modules, and ICs targeting electric vehicles, renewable…
PCIM 2025 featured advancements in SiC and GaN devices, power modules, and ICs targeting electric vehicles, renewable energy, and other high-power…
SemiQ, Infineon, Nexperia, and Navitas debuted SiC devices to tackle rising demands in thermal control, system…
SemiQ, Infineon, Nexperia, and Navitas debuted SiC devices to tackle rising demands in thermal control, system efficiency, and automotive-grade…
This year’s PCIM featured wide bandgap products from Rohde & Schwarz, Wise Integration, and Texas Instruments.
This year’s PCIM featured wide bandgap products from Rohde & Schwarz, Wise Integration, and Texas Instruments.
Infineon, EPC, and Navitas unveiled SiC and GaN technologies for electric vehicles, data centers, robotics, and…
Infineon, EPC, and Navitas unveiled SiC and GaN technologies for electric vehicles, data centers, robotics, and industrial motor drives at PCIM…
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
Infineon, Mitsubishi, and Navitas have released new power modules for high-voltage applications.
Infineon, Mitsubishi, and Navitas have released new power modules for high-voltage applications.
Navitas Semiconductor and GigaDevice have launched a joint R&D lab to integrate Navitas’ GaNFast power ICs with…
Navitas Semiconductor and GigaDevice have launched a joint R&D lab to integrate Navitas’ GaNFast power ICs with GigaDevice’s GD32…
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