ALLOS applied its unique strain-engineering to show outstanding uniformity and reproducibility for 200 mm GaN-on-Si epiwafers.
ALLOS applied its unique strain-engineering to show outstanding uniformity and reproducibility for 200 mm GaN-on-Si epiwafers.
Infineon Technologies expands its Schottky Diode portfolio by adding six devices in D2PAK real 2-pin package.
Infineon Technologies expands its Schottky Diode portfolio by adding six devices in D2PAK real 2-pin package.
This article introduces MORNSUN's PV200-29Bxx series and LMF150-20Bxx series.
This article introduces MORNSUN's PV200-29Bxx series and LMF150-20Bxx series.
By pairing the SCALE-iDriver control and safety features with its high-speed FluxLink™ communication technology, Power…
By pairing the SCALE-iDriver control and safety features with its high-speed FluxLink™ communication technology, Power Integrations delivers a…
The 3 kW ZHR483KS uses Transphorm’s GaN devices to reach 98 percent efficiency.
The 3 kW ZHR483KS uses Transphorm’s GaN devices to reach 98 percent efficiency.
Richardson RFPD announced the availability and full design support capabilities for a new silicon carbide module from…
Richardson RFPD announced the availability and full design support capabilities for a new silicon carbide module from Wolfspeed, a Cree Company.
Bel Power Solutions introduces TXP4000 Series, a fan-cooled PSU for industrial, process and control, railway and…
Bel Power Solutions introduces TXP4000 Series, a fan-cooled PSU for industrial, process and control, railway and machinery applications.
Toshiba Electronics Europe announced its new IGBT/MOSFET gate driver with additional built-in functionality.
Toshiba Electronics Europe announced its new IGBT/MOSFET gate driver with additional built-in functionality.
USB-C is rapidly becoming established as a replacement for Micro-B or Mini-B plugs, for both power and data connections,…
USB-C is rapidly becoming established as a replacement for Micro-B or Mini-B plugs, for both power and data connections, as it offers the…
The new 90 W PoE portfolio more than doubles standard PoE power and expands the capabilities of wireless access points…
The new 90 W PoE portfolio more than doubles standard PoE power and expands the capabilities of wireless access points and IoT wireless gateways.
Efficient Power Conversion (EPC) introduces the first of a new integrated circuit (IC) product family offering higher…
Efficient Power Conversion (EPC) introduces the first of a new integrated circuit (IC) product family offering higher performance and smaller…
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
Infineon introduces new devices in its new family of integrated-point-of-load voltage regulators.
Infineon introduces new devices in its new family of integrated-point-of-load voltage regulators.
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