Toshiba Announces New Dual Output IGBT / MOSFET DriverMarch 19, 2020 by Toshiba Electronics Europe
Toshiba Electronics Europe announced its new IGBT/MOSFET gate driver with additional built-in functionality.
Enhanced device includes comprehensive fault detection to simplify circuit design
Toshiba Electronics Europe GmbH has today announced a new IGBT/MOSFET gate driver equipped with additional built-in functionality. The new TLP5231 will simplify the design task in a wide range of applications including industrial inverters, uninterruptible power supplies (UPS), power conditioners for solar energy and motor controls.
Image courtesy of Toshiba Electronics Europe.
The TLP5231 pre-driver has a pair of outputs that are designed to drive external p-channel and n-channel MOSFETs used for current buffers. This allows the usage of a wide range of MOSFETs with various current ratings, meaning that the IGBT can be controlled by a rail to rail gate voltage. The driver can source and sink peak currents up to 2.5 A and is rated for 1.0 A continuously.
The device incorporates overcurrent detection, implemented by sensing VCE(sat) as well as undervoltage lock out (UVLO), both of which provide an open collector fault signal to the primary side. These features are not available on existing products (such as the TLP5214 & TLP5214A) and their inclusion on the TLP5231 significantly eases the process of gate drive circuit design.
Additionally, the “gate voltage soft turn off time” after VCE(sat) overcurrent detection can be controlled by another external n-channel MOSFET. Propagation delays (L/H & H/L) are as low as 100ns.
Despite being housed in a tiny SO16L surface mount package, the TLP5231 offers an isolation voltage (BVs) of 5000 Vrms (min.) with an internal isolation thickness in excess of 0.4 mm. Creepage and clearance distances are at least 8.0 mm, making it suitable for safety-critical applications.
Shipments of the new device start today.
Toshiba Electronics Europe (TEE) is the European electronic components business of Toshiba Corporation, which is ranked among the world’s largest semiconductor vendors. TEE offers one of the industry‘s broadest IC and discrete product lines including high-end memory, microcontrollers, ASICs and ASSPs for automotive, multimedia, industrial, telecoms and networking applications. The company also has a wide range of power semiconductor solutions as well as storage products like HDDs, SSDs, SD Cards and USB sticks.
TEE was formed in 1973 in Neuss, Germany, providing design, manufacturing, marketing and sales and now has headquarters in Düsseldorf, Germany, with branch offices in France, Italy, Spain, Sweden and the United Kingdom. TEE employs approximately 300 people in Europe. Company president is Mr. Takashi Nagasawa.
Toshiba Corporation is a world-leading diversified manufacturer, solutions provider and marketer of advanced electronic and electrical products and systems. Toshiba Group brings innovation and imagination to a wide range of businesses: digital products, including LCD TVs, notebook PCs, retail solutions and MFPs; electronic devices, including semiconductors, storage products and materials; industrial and social infrastructure systems, including power generation systems, smart community solutions, medical systems and escalators & elevators; and home appliances. Toshiba was founded in 1875, and today operates a global network of more than 590 consolidated companies, with 206,000 employees worldwide and annual sales surpassing US$61 billion.