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0.6A Step-Down Synchronous DC-DC Converters

0.6A Step-Down Synchronous DC-DC Converters

High Speed, Bidirectional Level Shifter for Networks and Servers

High Speed, Bidirectional Level Shifter for Networks and Servers

Polymer Tantalum Chip Capacitors with ESR Down to 7mΩ

Polymer Tantalum Chip Capacitors with ESR Down to 7mΩ

3-Phase Sensorless BLDC Motor Development Kit

3-Phase Sensorless BLDC Motor Development Kit

Silicon Carbide SiC Products for High-Voltage Reliable Power Electronics

Silicon Carbide SiC Products for High-Voltage Reliable Power Electronics

This article highlights Microchip’s 700V SiC MOSFETs, and 700V and 1200V SiC Schottky Barrier Diodes (SBDs) join its existing portfolio of SiC…


European Research Project Power2Power for More Efficient Power Semiconductors Launches in Dresden

European Research Project Power2Power for More Efficient Power Semiconductors Launches in Dresden

The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight countries will research and develop…


EPC to Provide eGaN Power Devices in Wafer Form

EPC to Provide eGaN Power Devices in Wafer Form

Efficient Power Conversion (EPC) will provide their industry-leading gallium nitride-based power devices in wafer form for ease of power systems…


new products Jun 04, 2019 by EPC
Infineon to Acquire Cypress Strengthening and Accelerating its Path of Profitable Growth

Infineon to Acquire Cypress Strengthening and Accelerating its Path of Profitable Growth

Infineon Technologies AG and Cypress Semiconductor Corporation today announced that the companies have signed a definitive agreement under which…


Integrated GaAs Tech Enables Single Chip GaAs Solutions For 5G and mmWave

Integrated GaAs Tech Enables Single Chip GaAs Solutions For 5G and mmWave

MagnaChip Offers High Voltage Options for Second Gen. 0.13-micron Embedded Flash Process

MagnaChip Offers High Voltage Options for Second Gen. 0.13-micron Embedded Flash Process

Toshiba Launches Low Power Consumption Brushed DC Motor Driver IC with Popular Pin assignment HSOP8 Package

Toshiba Launches Low Power Consumption Brushed DC Motor Driver IC with Popular Pin assignment HSOP8 Package

This article highlights Toshiba launched of “TB67H450FNG,” the latest addition to its line-up of brushed DC motor driver ICs with maximum…


Fifth Annual GaN Systems Cup China Power Supply Society Design Competition is Underway

Fifth Annual GaN Systems Cup China Power Supply Society Design Competition is Underway

This article highlights GaN Systems fifth annual GaN Systems Cup China power supply society design competition with teams from leading universities…


new products May 29, 2019 by GaN Systems
CISSOID Announces New High Temperature Automotive ICs at PCIM 2019 in Nuremberg

CISSOID Announces New High Temperature Automotive ICs at PCIM 2019 in Nuremberg

CISSOID introduces the CXT-STA4919, a new high-temperature, high-reliability, 50mA adjustable linear voltage regulator generating any regulated…


new products May 23, 2019 by CISSOID
Ultra Low-Power Edge AI Chip and 3D Artificial Intelligence Solution

Ultra Low-Power Edge AI Chip and 3D Artificial Intelligence Solution

10W GaN-on-SiC MMIC K/Ka-Band High Power Amplifier

10W GaN-on-SiC MMIC K/Ka-Band High Power Amplifier

SiC-Based 7.4kW/11kW/22kW Onboard Battery Charger for EVs and HEVs

SiC-Based 7.4kW/11kW/22kW Onboard Battery Charger for EVs and HEVs

Accelerating Time-to-Market for High-Power Designs and Wide Bandgap Devices

Accelerating Time-to-Market for High-Power Designs and Wide Bandgap Devices

475mA to 800mA, 7-Channel LDO with Low Output Noise & High PSRR

475mA to 800mA, 7-Channel LDO with Low Output Noise & High PSRR

Efficient Power Conversion CEO and CoFounder Inducted into the ISPSD Hall of Fame 2019

Efficient Power Conversion CEO and CoFounder Inducted into the ISPSD Hall of Fame 2019

EPC Corporation proudly announces that Dr. Alex Lidow, CEO and co-founder, is inducted into the ISPSD Hall of Fame 2019.


new products May 15, 2019 by EPC
Cree Selected as Silicon Carbide Partner for the Volkswagen Group FAST Program

Cree Selected as Silicon Carbide Partner for the Volkswagen Group FAST Program

Cree, Inc. has been selected as the exclusive silicon carbide partner for the Volkswagen Group’s “Future Automotive Supply Tracks” Initiative…


new products May 14, 2019 by Cree