Efficient Power Conversion (EPC) introduces the first of a new integrated circuit (IC) product family offering higher…
Efficient Power Conversion (EPC) introduces the first of a new integrated circuit (IC) product family offering higher performance and smaller…
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
The Connected Lighting Platform for LED control features multiple forms of connectivity, including Bluetooth Low Energy,…
The Connected Lighting Platform for LED control features multiple forms of connectivity, including Bluetooth Low Energy, provided by the RSL10 SIP,…
This article discusses the double pulse test data demonstrating that the Pre-Switch soft-switching platform reduces total…
This article discusses the double pulse test data demonstrating that the Pre-Switch soft-switching platform reduces total system switching losses…
ON Semiconductor has expanded its range of wide bandgap (WBG) devices with the introduction of two additional families…
ON Semiconductor has expanded its range of wide bandgap (WBG) devices with the introduction of two additional families of silicon carbide (SiC).
This article introduces Texas Instruments new 40-A SWIFT DC/DC buck converter offering first-of-its-kind stackability of…
This article introduces Texas Instruments new 40-A SWIFT DC/DC buck converter offering first-of-its-kind stackability of up to four integrated…
The IPM technology offers an all-in-one solution including a 3-Phase water-cooled SiC MOSFET module with built-in gate drivers.
The IPM technology offers an all-in-one solution including a 3-Phase water-cooled SiC MOSFET module with built-in gate drivers.
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