The new drivers feature digital current sensing and are designed for applications powered by 12V batteries.
The new drivers feature digital current sensing and are designed for applications powered by 12V batteries.
Japanese silicon-carbide wafer provider Showa Denko recently signed a pair of long-term supply agreements with ROHM and Toshiba.
Japanese silicon-carbide wafer provider Showa Denko recently signed a pair of long-term supply agreements with ROHM and Toshiba.
The two power supply unit (PSU) designs offer either full bridge LLC resonant converter or bridgeless totem-pole PFC formats.
The two power supply unit (PSU) designs offer either full bridge LLC resonant converter or bridgeless totem-pole PFC formats.
Pre-Switch expands its operations with its new headquarters in San Jose and plans to accelerate the application of its…
Pre-Switch expands its operations with its new headquarters in San Jose and plans to accelerate the application of its AI-based technology to areas…
Engineers created a new battery technology that combines the benefits of solid-state electrolyte and an all-silicon anode.
Engineers created a new battery technology that combines the benefits of solid-state electrolyte and an all-silicon anode.
The unit offers a 300mA battery charger, three independent power rails, and a separate LDO output.
The unit offers a 300mA battery charger, three independent power rails, and a separate LDO output.
This article proposes a method to obtain optimal properties of silicon fast IGBT chips designed for joint operation with…
This article proposes a method to obtain optimal properties of silicon fast IGBT chips designed for joint operation with SiC SBD in hybrid modules.…
HVCB High Voltage Precision Chip Resistors Offer 0.1% Tolerance and 25 ppm TCR.
HVCB High Voltage Precision Chip Resistors Offer 0.1% Tolerance and 25 ppm TCR.
GaN Systems announces its entry into a collaboration with EPowerlabs to deliver up a new converter, DDC48-1K, for use in…
GaN Systems announces its entry into a collaboration with EPowerlabs to deliver up a new converter, DDC48-1K, for use in mobility applications.
Their goals are to improve efficiencies in the design and testing validation of GaN and SiC semiconductors.
Their goals are to improve efficiencies in the design and testing validation of GaN and SiC semiconductors.
The first series member is a highly integrated half-bridge device aimed at wireless charging applications.
The first series member is a highly integrated half-bridge device aimed at wireless charging applications.
The isolated, 1.5W DC/DC device employs a tiny internal planar transformer to cut power solution sizes in half for EVS and HEVs.
The isolated, 1.5W DC/DC device employs a tiny internal planar transformer to cut power solution sizes in half for EVS and HEVs.
New device completes Microchip’s family of Vref products providing increased reliability and AEC-Q100 qualification.
New device completes Microchip’s family of Vref products providing increased reliability and AEC-Q100 qualification.
The new unit features multiple levels of control, affording a high level of protection for SiC MOSFETs and the systems they power.
The new unit features multiple levels of control, affording a high level of protection for SiC MOSFETs and the systems they power.
ADL8150 features low phase noise of -172 dBc/Hz at 10 kHz offset, 12 dB signal gain, and +30dBm OIP3.
ADL8150 features low phase noise of -172 dBc/Hz at 10 kHz offset, 12 dB signal gain, and +30dBm OIP3.
Researchers develop microbatteries that are as thick as three sheets of paper, and can be embedded into sensor circuitry.
Researchers develop microbatteries that are as thick as three sheets of paper, and can be embedded into sensor circuitry.
GaN transistors and ICs increase power density in motor drive applications. An optimal lay-out approach allows obtaining…
GaN transistors and ICs increase power density in motor drive applications. An optimal lay-out approach allows obtaining ring-free output switching…
The SD11900 series maximizes power density while minimizing loop inductance with a pin configuration to allow simple…
The SD11900 series maximizes power density while minimizing loop inductance with a pin configuration to allow simple power bussing.
X-FAB Semiconductor Foundries announces completion of a licensing agreement with X-Celeprint and becomes world’s first…
X-FAB Semiconductor Foundries announces completion of a licensing agreement with X-Celeprint and becomes world’s first foundry to offer…
The new package enables EM/IR assessment of analog, digital, and mixed-signal IC designs of any size before committing to silicon.
The new package enables EM/IR assessment of analog, digital, and mixed-signal IC designs of any size before committing to silicon.