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TT Electronics Introduces New Family of Anti-Sulphur, High Reliability Thin Film Chip Resistors

TT Electronics Introduces New Family of Anti-Sulphur, High Reliability Thin Film Chip Resistors

This article highlights TT Electronics APC Series resistors with its family of high reliability surface mount resistors that have been qualified…


How Preserved Echoes Diagnose Component Failures

How Preserved Echoes Diagnose Component Failures

This article highlights SONOSCAN Acoustic micro imaging (AMI) tools that can nondestructively image internal structural anomalies such as cracks or…


Alpha and Omega Semiconductor Unveils New Generation of DrMOS Power Stage

Alpha and Omega Semiconductor Unveils New Generation of DrMOS Power Stage

Alpha and Omega Semiconductor announced a new series of DrMOS targeting multiphase VR regulators powering high-performance GPU and memory in…


Bizen Transistor Technology Delivers QJT power Transistors

Bizen Transistor Technology Delivers QJT power Transistors

Bizen has been verified by physical wafer results and calibration to deliver the same voltage levels, switching speeds and power handling…


EPC Increases Benchmark Performance with 100V eGaN FET Family

EPC Increases Benchmark Performance with 100V eGaN FET Family

EPC introduces new generation 100 V eGaN® FETs that are ideal for 48-VOUT synchronous rectification, class-D audio, infotainment, and lidar.


ON Semiconductor CEO Announces Retirement

ON Semiconductor CEO Announces Retirement

The president and CEO of one of the U.S.’s most prominent semiconductor manufacturers announced he’s stepping down to retire in May 2021.


News Sep 21, 2020 by Shannon Cuthrell
Maxim Adds Two Analog Temperature Sensor IC’s to its Essential Analog Portfolio

Maxim Adds Two Analog Temperature Sensor IC’s to its Essential Analog Portfolio

The new ICs reduce design complexity while delivering the high measurement accuracy for systems charged with the protection of cold-chain assets.


Transphorm Unveils 4kW Evaluation Board for Single-Phase AC-to-DC Power Conversion

Transphorm Unveils 4kW Evaluation Board for Single-Phase AC-to-DC Power Conversion

The TDTTP4000W065AN employs bridgeless totem-pole power factor correction topology with traditional analog control.


Power Integrations Targets Compact Smart-Lighting Designs with Highly Efficient GaN-Powered LYTSwitch-6 LED Drivers

Power Integrations Targets Compact Smart-Lighting Designs with Highly Efficient GaN-Powered LYTSwitch-6 LED Drivers

These enable dimmable 90 W LED ballasts in an isolated flyback topology following a boost Power Factor Correction (PFC) stage.


Ricoh launches Buck DC/DC Converter with 200 nA quiescent current for Energy Harvesting applications

Ricoh launches Buck DC/DC Converter with 200 nA quiescent current for Energy Harvesting applications

This article highlights Ricoh Electronics R1801 Buck DC/DC Converter, designed for use in the Internet of Things ecosystem by extracting energy…


Enabling Small, Cool, and Quiet Power Modules

Enabling Small, Cool, and Quiet Power Modules

This article highlights Texas Instruments DC/DC power module for balancing between efficiency, size, and thermal and EMI performance as challenges…


Mitsubishi Electric to Launch Second-generation Full-SiC Power Modules for Industrial Use

Mitsubishi Electric to Launch Second-generation Full-SiC Power Modules for Industrial Use

Mitsubishi Electric features its coming launch of second-generation full-SiC (silicon carbide) power modules featuring a newly developed SiC chip…


1200V SiC MOSFET Reduces Space and Increases Efficiency

1200V SiC MOSFET Reduces Space and Increases Efficiency

Mitsubishi Electric announces the addition of the new N-series SiCMOSFETs in a TO-247 package (under development) to the product portfolio in the…


Bel Fuse Announces 0685P Series of Surface Mount Fast-Acting Chip Fuses

Bel Fuse Announces 0685P Series of Surface Mount Fast-Acting Chip Fuses

This article highlights Bel Fuse's 0685P Series of surface mount fast-acting chip fuses with high inrush current withstand capability in a…


Bonding Ribbon for the Next Generation of Power Electronics

Bonding Ribbon for the Next Generation of Power Electronics

he product enables power modules to be designed and manufactured more reliably, efficiently, and cost-effectively.


News Sep 14, 2020 by Hailey Stewart
ON Semi to Sell Japanese Power Fabs

ON Semi to Sell Japanese Power Fabs

Power device giant ON Semiconductor seeks to sell two wafer fabs in Niigata, Japan.


News Sep 13, 2020 by Shannon Cuthrell
Allegro MicroSystems Acquires Voxtel to Expand Development of LiDAR Technologies

Allegro MicroSystems Acquires Voxtel to Expand Development of LiDAR Technologies

Allegro MicroSystems joined forces with Voxtel to initiate innovative advanced driver assistance systems for vehicles of the future.


News Sep 12, 2020 by Stephanie Leonida
Researchers Find Graphene Ribbons Mimic Semiconductor Materials

Researchers Find Graphene Ribbons Mimic Semiconductor Materials

Physicists and chemists from the Swedish Universities of Basel and Bern have produced the first porous graphene ribbons in which specific carbon…


Maxim Integrated Introduces a Mobile App for Analog IC Information

Maxim Integrated Introduces a Mobile App for Analog IC Information

Maxim Integrated releases a new app that provides systems engineers with a large repository of resources centered around its range of…


News Sep 09, 2020 by Stephanie Leonida
Designing a Double-Pulse Test System to Enable Correlation of Dynamic Characteristics

Designing a Double-Pulse Test System to Enable Correlation of Dynamic Characteristics

This article discusses important considerations when designing a standard DPT system used to correlate results between multiple test systems.