EEPower

Latest Methods New Products

Categories

1200A Current Probe for High-Speed and High Power-Density Measurements

1200A Current Probe for High-Speed and High Power-Density Measurements

Protocol Analyzer Platform for Next-Generation USB4 and Thunderbolt 3

Protocol Analyzer Platform for Next-Generation USB4 and Thunderbolt 3

JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

 JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices


new products Mar 01, 2019 by JEDEC
EMI Application Mode Added to Spectrum Analyzers for Pre-Compliance Analysis

EMI Application Mode Added to Spectrum Analyzers for Pre-Compliance Analysis

Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

Multi-Device Calibrator for International Standards

Multi-Device Calibrator for International Standards

Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX Workshop 2019

Indium Corporation Features Metal Thermal Interface Materials for Burn-In and Test at TestConX Workshop 2019

Indium Corporation will feature its metal thermal interface materials for burn-in and test, including HSK patterned Heat-Spring® and HSMF-OS, at…


3-Phase Power Analysis Software Enables More Thorough Power-Conversion System Evaluations

3-Phase Power Analysis Software Enables More Thorough Power-Conversion System Evaluations

Wurth Electronics Raises the Bar for EFTB Testing

Wurth Electronics Raises the Bar for EFTB Testing

Electrical Fast Transient Burst (EFTB) is an electrical phenomenon, which plagues industrial environments.


Power Rail Probes with Lowest System Noise

Power Rail Probes with Lowest System Noise

Ironwood Electronics Introduces Clamshell Production Test Socket for BGA1089

Ironwood Electronics Introduces Clamshell Production Test Socket for BGA1089

Ironwood Electronics recently introduced a new stamped spring pin socket addressing high-performance requirements for testing BGA1089 - CBT-BGA-6082.


High-Voltage VI Source and Measurement System for Power Semis

High-Voltage VI Source and Measurement System for Power Semis

0.5A/5W Through-Hole Reed Relays Switch in 80µs

0.5A/5W Through-Hole Reed Relays Switch in 80µs

Dual-Channel Multimeter Combines Density with Performance

Dual-Channel Multimeter Combines Density with Performance

Mixed Signal Oscilloscope with Dedicated Power Supply Analysis Options

Mixed Signal Oscilloscope with Dedicated Power Supply Analysis Options

EV/HEV Battery Test System Utilizes Regenerative Technology

EV/HEV Battery Test System Utilizes Regenerative Technology

Stamped Spring Pin Socket for Burn-in and Test Applications

Stamped Spring Pin Socket for Burn-in and Test Applications

Ironwood Electronics recently introduced a new socket—the SBT-BGA-6553—to address high-performance requirements for burn-in and test…


Power Analyzer with Seven Inputs and ±0.03% Measurement Accuracy

Power Analyzer with Seven Inputs and ±0.03% Measurement Accuracy

10kW 3U 19” DC Programmable Laboratory Power Supply

10kW 3U 19” DC Programmable Laboratory Power Supply

1-MW Water-Cooled DC Electronic Load Simulates Shipboard Power

1-MW Water-Cooled DC Electronic Load Simulates Shipboard Power