Ironwood Electronics Introduces Clamshell Production Test Socket for BGA1089

Ironwood Electronics recently introduced a new stamped spring pin socket addressing high-performance requirements for testing BGA1089 - CBT-BGA-6082.

The contactor is a stamped spring pin (PDF) with 19-gram actuation force per ball and cycle life of 125,000 insertions. The self-inductance of the contactor is 0.93 nH, insertion loss < 1 dB at 21.9 GHz and capacitance 0.097pF. The current capacity of each contactor is 4 amps at 40C temperature rise. Socket temperature range is -55C to +180C.

Socket features a clamshell lid design for ease of chip replacement in production environment. It also has an integrated compression plate for vertical force actuation without distorting device position. The specific configuration of the package to be tested in the CBT-BGA-6082 is a BGA, 35x35mm, 1mm pitch 33x33 array with 1089 balls.

The socket is mounted using supplied hardware on the target PCB with no soldering and uses the smallest footprint in the industry. The smallest footprint allows inductors, resistors and decoupling capacitors to be placed very close to the device for impedance tuning. To use, place BGA device into the socket and close the lid by snapping to the latch. Vertical force is applied by turning the compression screw.

Socket was made of aluminum components for power dissipation and it can be customized for higher power dissipation by adding axial flow fan plus finned heat sink. This socket can be used for quick device screening, device characterization at extreme temperatures as well as final production test. 

About Ironwood Electronics

Ironwood Electronics is ISO9001:2008 certified and offers a wide selection of high performance adapters and sockets, plus experienced engineering for quick-turn customs. Ironwood Electronics offer probing, prototype, and SMT package emulation for all SMT packages. Ironwood Electronics products include High-bandwidth 40 GHz sockets for BGA/QFN, pitches down to 0.3 mm, only 2.5 mm larger than IC. Latest adapters include QFN/MLF package emulators, BGA high endurance test sockets, BGA production adapters, and back-to-back Xilinx-compatible BGA sockets. These adapters/sockets support the product life cycle. In the design cycle, engineers are able to test and develop products more quickly with Ironwood prototype and test adapters for all package type--along with the very high density 40 GHz BGA and QFN/MLF sockets. In production, Ironwood can help extend the product life of PCBs, using package converter technology to replace or upgrade original or obsolete components and provide small to high volume turn-key solutions.