The expanded series offers higher working voltages to 1000 V in smaller form factors.
The expanded series offers higher working voltages to 1000 V in smaller form factors.
The photorelay aims at 800 V battery management systems in electric vehicles and energy storage applications.
The photorelay aims at 800 V battery management systems in electric vehicles and energy storage applications.
The 1200 V CoolSiC G2 MOSFETs deliver higher power density, lower losses, and improved thermal performance for industrial systems.
The 1200 V CoolSiC G2 MOSFETs deliver higher power density, lower losses, and improved thermal performance for industrial systems.
Toshiba’s SOP Advance(E) package yields lower losses and better thermal performance.
Toshiba’s SOP Advance(E) package yields lower losses and better thermal performance.
Littelfuse, Nexperia, and Vishay have released diode products that provide designers with upgraded features.
Littelfuse, Nexperia, and Vishay have released diode products that provide designers with upgraded features.
Wise Integration’s WiseWare 1.1 targets compact, high-efficiency AC-DC converters with integrated ZVS control and broad…
Wise Integration’s WiseWare 1.1 targets compact, high-efficiency AC-DC converters with integrated ZVS control and broad GaN compatibility.
The family brings 18-channel monitoring and SPI-to-TPL bridge to electric vehicle and energy storage applications.
The family brings 18-channel monitoring and SPI-to-TPL bridge to electric vehicle and energy storage applications.
The FLXPro Series offers a digitally configurable AC-DC power supply with high power density and modular outputs.
The FLXPro Series offers a digitally configurable AC-DC power supply with high power density and modular outputs.
Rohm’s high-speed isolated gate driver IC is optimized for HV-GaN HEMTs.
Rohm’s high-speed isolated gate driver IC is optimized for HV-GaN HEMTs.
EPC9196 brings high-speed, medium-voltage BLDC drive capability to compact platforms.
EPC9196 brings high-speed, medium-voltage BLDC drive capability to compact platforms.
STMicroelectronics’ STDRIVEG610 and STDRIVEG611 deliver optimized control for GaN-based power and motor systems.
STMicroelectronics’ STDRIVEG610 and STDRIVEG611 deliver optimized control for GaN-based power and motor systems.
The MOSFETs feature numerous structural and material innovations in a DFN 8x8 package.
The MOSFETs feature numerous structural and material innovations in a DFN 8x8 package.
TDK, Littelfuse, and Novosense have released components targeting scalability, thermal resilience, and EMI issues.
TDK, Littelfuse, and Novosense have released components targeting scalability, thermal resilience, and EMI issues.
The company has launched five reference designs with its InnoSwitch3-AQ flyback ICs, targeting inverter power, battery…
The company has launched five reference designs with its InnoSwitch3-AQ flyback ICs, targeting inverter power, battery replacement, and emergency…
The gate driver features advanced safety compliance and performance.
The gate driver features advanced safety compliance and performance.
The latest devices from Microchip, Rohm, and Semi-Q offer enhanced radiation protection, increased operation range, lower…
The latest devices from Microchip, Rohm, and Semi-Q offer enhanced radiation protection, increased operation range, lower conduction losses, and…
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
With its compact heat dissipation design, the new modules are designed to "sets a new standard for onboard chargers."
The new device keeps the high-frequency switching benefits of GaN while addressing the historical lack of a true reverse…
The new device keeps the high-frequency switching benefits of GaN while addressing the historical lack of a true reverse body diode.
Navitas and Great Wall Power have launched a 2.5kW GaN-based DC-DC converter with record power density and efficiency,…
Navitas and Great Wall Power have launched a 2.5kW GaN-based DC-DC converter with record power density and efficiency, targeting AI data centers…
New components from GAIA, Infineon, Metis, ROHM, and TDK focus on improving power density, system safety, and integration…
New components from GAIA, Infineon, Metis, ROHM, and TDK focus on improving power density, system safety, and integration across energy,…