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Small eGaN FET has Low Price for HF Switching

Small eGaN FET has Low Price for HF Switching

1.2kV IGBT E3 and SIMBUS F Power Module Series

1.2kV IGBT E3 and SIMBUS F Power Module Series

High-Inductance and Low-DCR 0402-sized Chip Inductors

High-Inductance and Low-DCR 0402-sized Chip Inductors

2MHz Monolithic GaN Half Bridge targets Class-D Audio

2MHz Monolithic GaN Half Bridge targets Class-D Audio

Dialog Semiconductor supports Huawei Fast-Charger Protocol

Dialog Semiconductor supports Huawei Fast-Charger Protocol

German Chancellor Angela Merkel visits stateoftheart chip manufacturing plant of Infineon Dresden

German Chancellor Angela Merkel visits stateoftheart chip manufacturing plant of Infineon Dresden

German Chancellor Dr. Angela Merkel visited Infineon Technologies Dresden GmbH today as part of her tour through the Dresden micro-electronics…


Transphorm Announces New 70 million Investment Led by KKR

Transphorm Announces New 70 million Investment Led by KKR

Transphorm Inc, an early stage semiconductor company focused on redefining power conversion, announced a $70 million investment round led by global…


new products Aug 01, 2015 by Transphorm
One-Chip PMIC for Energy Harvesting Systems

One-Chip PMIC for Energy Harvesting Systems

MIT Spinout enters GaN Power Race

MIT Spinout enters GaN Power Race

Wide Input Voltage 3 A Synchronous Buck Regulator IC

Wide Input Voltage 3 A Synchronous Buck Regulator IC

High-Precision Li-ion Battery Fuel Gauge IC

High-Precision Li-ion Battery Fuel Gauge IC

Electrolytic Chip Capacitors for Consumer Appliances

Electrolytic Chip Capacitors for Consumer Appliances

Chip-Type Electrolytics Specified for 2000 Hrs at 125 C

Chip-Type Electrolytics Specified for 2000 Hrs at 125 C

Packaging Layout improves FET Thermal Performance

Packaging Layout improves FET Thermal Performance

Tabuchi Electric Enters US Market with SiC PV Inverter

Tabuchi Electric Enters US Market with SiC PV Inverter

GaN Power Integrated Circuit for Wireless Power Transfer

GaN Power Integrated Circuit for Wireless Power Transfer

Medium-Power Transistors with Solderable Side Pads

Medium-Power Transistors with Solderable Side Pads

Thick-Film Chip Resistors Offer High Thermal Conductivity

Thick-Film Chip Resistors Offer High Thermal Conductivity

Dual Die Hall-Effect Angle Sensor ICs for Motor Position Applications

Dual Die Hall-Effect Angle Sensor ICs for Motor Position Applications

Benchtop Systems for IC Temperature Testing

Benchtop Systems for IC Temperature Testing