AOS’ DFN 5x6 double-sided cooling package promises to overcome the challenge of cooling power MOSFETs in power electronics.
AOS’ DFN 5x6 double-sided cooling package promises to overcome the challenge of cooling power MOSFETs in power electronics.
Littelfuse has rolled out TTape, an innovative temperature monitoring and detection system that seamlessly integrates…
Littelfuse has rolled out TTape, an innovative temperature monitoring and detection system that seamlessly integrates with electric vehicle battery…
By adding models for its silicon carbide and IGBT devices, ROHM has expanded its library of LTspice models to more than…
By adding models for its silicon carbide and IGBT devices, ROHM has expanded its library of LTspice models to more than 3,500, expanding circuit…
Ultra-low-profile inductors and capacitors from Murata and TDK are pushing the limits for component density and impacting…
Ultra-low-profile inductors and capacitors from Murata and TDK are pushing the limits for component density and impacting automotive safety and…
New toroidal power factor correction chokes from Würth use flat wire windings that result in fewer winding losses when…
New toroidal power factor correction chokes from Würth use flat wire windings that result in fewer winding losses when compared with traditional…
Today’s power system designers face an increasingly complex hardware and software ecosystem, but a new product from…
Today’s power system designers face an increasingly complex hardware and software ecosystem, but a new product from Qorvo could change that,…
The self-control fuse products make safety a primary factor in power system design. This article will examine Eaton’s…
The self-control fuse products make safety a primary factor in power system design. This article will examine Eaton’s technology and its role in…
The new product features a turn-off circuit integrated into an optocoupler.
The new product features a turn-off circuit integrated into an optocoupler.
Toyochem introduces sintering nano-silver pastes engineered for power electronics bonding in automotive applications.
Toyochem introduces sintering nano-silver pastes engineered for power electronics bonding in automotive applications.
Three-phase bridge power modules from Microchip use high-voltage SiC and IGBT switches to power More Electric Aircraft…
Three-phase bridge power modules from Microchip use high-voltage SiC and IGBT switches to power More Electric Aircraft applications.
Celanese will feature advanced material initiatives for electric vehicles and consumer electronics.
Celanese will feature advanced material initiatives for electric vehicles and consumer electronics.
Skyworks’ reference design pairs isolated gate drivers with Wolfspeed high-voltage SiC FET power modules.
Skyworks’ reference design pairs isolated gate drivers with Wolfspeed high-voltage SiC FET power modules.
New Sequoia and Tahoe Series generate precision AC and DC power signals for regenerative load simulation and complex…
New Sequoia and Tahoe Series generate precision AC and DC power signals for regenerative load simulation and complex power system development.
The new FT Series high-voltage power supply from XP Power is targeted for ion implantation, e-beam welding, and e-beam…
The new FT Series high-voltage power supply from XP Power is targeted for ion implantation, e-beam welding, and e-beam additive manufacturing…
Alpha & Omega Semiconductor has announced new 650- and 750-volt silicon carbide MOSFETs for solar inverters, motor…
Alpha & Omega Semiconductor has announced new 650- and 750-volt silicon carbide MOSFETs for solar inverters, motor drives, industrial power…
Available with narrow and wide input ranges, TRACO Power’s DC/DC converter provides high-power density conversion for…
Available with narrow and wide input ranges, TRACO Power’s DC/DC converter provides high-power density conversion for industrial, automation, and…
New BMS transformer from iNRCORE provides isolation and EMI suppression for EV battery management communications with…
New BMS transformer from iNRCORE provides isolation and EMI suppression for EV battery management communications with improved reliability.
Bourns has added a third pin for supply ground and precision through-hole pin placement in its CSM2F Series, helping the…
Bourns has added a third pin for supply ground and precision through-hole pin placement in its CSM2F Series, helping the accuracy of current…
Analog Devices' portfolio of antenna-to-bits solutions makes possible today’s mission-critical and rugged advanced…
Analog Devices' portfolio of antenna-to-bits solutions makes possible today’s mission-critical and rugged advanced aircraft, space systems,…
LTC7051-1, with integrated drivers and switches, powers the next generation of high-current processors.
LTC7051-1, with integrated drivers and switches, powers the next generation of high-current processors.
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