NXP Semiconductors has integrated Gallium Nitride (GaN) technology into its 5G multi-chip module platform.
NXP Semiconductors has integrated Gallium Nitride (GaN) technology into its 5G multi-chip module platform.
High cooling capacity with minimal pressure drop is a convincing feature of the new IsoMAXX cold plates from Mersen.
High cooling capacity with minimal pressure drop is a convincing feature of the new IsoMAXX cold plates from Mersen.
Learn about the principles of and the operation of the field-effect transistor.
Learn about the principles of and the operation of the field-effect transistor.
The new monolithic microwave integrated Circuit (MMIC) delivers 10W of saturated RF output power over a 27.5 to 31GHz range
The new monolithic microwave integrated Circuit (MMIC) delivers 10W of saturated RF output power over a 27.5 to 31GHz range
STMicroelectronics and Renault enter into a partnership to design, produce, and supply power electronics systems for…
STMicroelectronics and Renault enter into a partnership to design, produce, and supply power electronics systems for improved electric and hybrid…
Power electronics manufacturer Eggtronic recently announced a new AC wireless power hybrid technology.
Power electronics manufacturer Eggtronic recently announced a new AC wireless power hybrid technology.
The demand for high power density converters in EVs requires further integration of sensors within power electronics.
The demand for high power density converters in EVs requires further integration of sensors within power electronics.
Researchers at the University of Bristol discovered a method to quantify electric fields with a semiconductor device…
Researchers at the University of Bristol discovered a method to quantify electric fields with a semiconductor device which would lead to the…
A photovoltaic coupler, such as the new TLP3910, is a photorelay that contains the optical elements but not the MOSFET…
A photovoltaic coupler, such as the new TLP3910, is a photorelay that contains the optical elements but not the MOSFET that performs the…
Both N-Channel devices feature a source-drain recovery charge (QRR) of zero and a very low total gate charge (QG).
Both N-Channel devices feature a source-drain recovery charge (QRR) of zero and a very low total gate charge (QG).
A semiconductor trade association and an automotive industry think tank team up for a supply chain partnership.
A semiconductor trade association and an automotive industry think tank team up for a supply chain partnership.
This article highlights EPC discrete eGaN FETs and Integrated Circuit ePower™ stages.
This article highlights EPC discrete eGaN FETs and Integrated Circuit ePower™ stages.
Several companies have released new models of rad-hard technologies in the last several months.
Several companies have released new models of rad-hard technologies in the last several months.
The surface mounted units are housed in TO 263-7L package and deliver up to 48 watts with no heatsink required
The surface mounted units are housed in TO 263-7L package and deliver up to 48 watts with no heatsink required
Nexperia is earmarking $700 million to boost production capacity at its wafer fabs and assembly facilities worldwide.
Nexperia is earmarking $700 million to boost production capacity at its wafer fabs and assembly facilities worldwide.
Recent years have seen evolving markets of battery-driven applications and advanced industrial equipment such as 5G base…
Recent years have seen evolving markets of battery-driven applications and advanced industrial equipment such as 5G base stations and factory…
Imec recently updated its progress in developing technologies for a backside power delivery network. Five VLSI 2021…
Imec recently updated its progress in developing technologies for a backside power delivery network. Five VLSI 2021 papers discuss the impact of…
The new single-channel, bidirectional Transient Voltage Suppressors (TVS) provide ESD protection for USB Type-C applications
The new single-channel, bidirectional Transient Voltage Suppressors (TVS) provide ESD protection for USB Type-C applications
A team of scientists from Tokyo Institute of Technology developed a 3D functional interposer that saves package area and…
A team of scientists from Tokyo Institute of Technology developed a 3D functional interposer that saves package area and allows for low noise and…
Facebook
Google
GitHub
Linkedin