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VPG Releases New Flip-Chip 0805 Resistor Based on Z1 Foil Technology

VPG Releases New Flip-Chip 0805 Resistor Based on Z1 Foil Technology

Smallest PFC Boost IC in a 5-pin SOT-23 Package Claimed by IR

Smallest PFC Boost IC in a 5-pin SOT-23 Package Claimed by IR

High-Output Power Digital Audio System-on-Chip Delivers 2 X 20W

High-Output Power Digital Audio System-on-Chip Delivers 2 X 20W

Taiyo Yuden Expands Lineup of Multilayer Chip Bead Inductors for Smartphones

Taiyo Yuden Expands Lineup of Multilayer Chip Bead Inductors for Smartphones

ProTek Introduces its First Family of Overcurrent Electronics Chip Fuses

ProTek Introduces its First Family of Overcurrent Electronics Chip Fuses

ZMDI Intros “Hybrid” Single-Phase Digital/Analog PWM Controller IC

ZMDI Intros “Hybrid” Single-Phase Digital/Analog PWM Controller IC

ROHM Claims Industry’s First Leakage-Detection IC for Automotive Applications

ROHM Claims Industry’s First Leakage-Detection IC for Automotive Applications

DC-DC Converter IC Saves Space in LED Lighting Applications

DC-DC Converter IC Saves Space in LED Lighting Applications

New Toshiba Microcontroller Offers Largest On-Chip SRAM in Its Class

New Toshiba Microcontroller Offers Largest On-Chip SRAM in Its Class

Chip-Scale Schottky Can Double Power Density

Chip-Scale Schottky Can Double Power Density

PFC IC has Controller, MOSFET, Boost Diode; for Smaller, More Reliable, Lower-Cost Designs

PFC IC has Controller, MOSFET, Boost Diode; for Smaller, More Reliable, Lower-Cost Designs

KEMET Announces Three New Tantalum Chip Capacitor Series

KEMET Announces Three New Tantalum Chip Capacitor Series

Automotive MCU Integrates Digital Power Supply System Functions onto a Single Chip

Automotive MCU Integrates Digital Power Supply System Functions onto a Single Chip

Renesas New USB 2.0 Hub Controller Chip Supports Battery Rapid Charging

Renesas New USB 2.0 Hub Controller Chip Supports Battery Rapid Charging

TDK Intros Multilayer Chip Beads that are 80% Smaller in Volume and 65% in Area

TDK Intros Multilayer Chip Beads that are 80% Smaller in Volume and 65% in Area

SiC and GaN Again a Major Focus at PCIM Europe

SiC and GaN Again a Major Focus at PCIM Europe

SiC Modules, IGBTs and Super-Junction MOSFETs Introduced on Day One of PCIM

SiC Modules, IGBTs and Super-Junction MOSFETs Introduced on Day One of PCIM

Gate Drive Optocouplers  for High-Speed SiC FETs Deliver up to 2.5A

Gate Drive Optocouplers for High-Speed SiC FETs Deliver up to 2.5A

Vicor’s ChiP Power Component Packaging Technology to Make European Debut at PCIM

Vicor’s ChiP Power Component Packaging Technology to Make European Debut at PCIM

KOA Speer and Stackpole Introduce Chip Resistors

KOA Speer and Stackpole Introduce Chip Resistors