EEPower

Latest Silicon Carbide New Products

Categories

Taiyo Yuden Expands Lineup of Multilayer Chip Bead Inductors for Smartphones

Taiyo Yuden Expands Lineup of Multilayer Chip Bead Inductors for Smartphones

new products Jul 10, 2013 by Jeff Shepard
ProTek Introduces its First Family of Overcurrent Electronics Chip Fuses

ProTek Introduces its First Family of Overcurrent Electronics Chip Fuses

new products Jul 07, 2013 by Jeff Shepard
ZMDI Intros “Hybrid” Single-Phase Digital/Analog PWM Controller IC

ZMDI Intros “Hybrid” Single-Phase Digital/Analog PWM Controller IC

new products Jul 02, 2013 by Jeff Shepard
ROHM Claims Industry’s First Leakage-Detection IC for Automotive Applications

ROHM Claims Industry’s First Leakage-Detection IC for Automotive Applications

new products Jun 30, 2013 by Jeff Shepard
DC-DC Converter IC Saves Space in LED Lighting Applications

DC-DC Converter IC Saves Space in LED Lighting Applications

new products Jun 27, 2013 by Jeff Shepard
New Toshiba Microcontroller Offers Largest On-Chip SRAM in Its Class

New Toshiba Microcontroller Offers Largest On-Chip SRAM in Its Class

new products Jun 26, 2013 by Jeff Shepard
Chip-Scale Schottky Can Double Power Density

Chip-Scale Schottky Can Double Power Density

new products Jun 05, 2013 by Jeff Shepard
PFC IC has Controller, MOSFET, Boost Diode; for Smaller, More Reliable, Lower-Cost Designs

PFC IC has Controller, MOSFET, Boost Diode; for Smaller, More Reliable, Lower-Cost Designs

new products May 30, 2013 by Jeff Shepard
KEMET Announces Three New Tantalum Chip Capacitor Series

KEMET Announces Three New Tantalum Chip Capacitor Series

new products May 28, 2013 by Jeff Shepard
Automotive MCU Integrates Digital Power Supply System Functions onto a Single Chip

Automotive MCU Integrates Digital Power Supply System Functions onto a Single Chip

new products May 21, 2013 by Jeff Shepard
Renesas New USB 2.0 Hub Controller Chip Supports Battery Rapid Charging

Renesas New USB 2.0 Hub Controller Chip Supports Battery Rapid Charging

new products May 21, 2013 by Jeff Shepard
TDK Intros Multilayer Chip Beads that are 80% Smaller in Volume and 65% in Area

TDK Intros Multilayer Chip Beads that are 80% Smaller in Volume and 65% in Area

new products May 20, 2013 by Jeff Shepard
SiC and GaN Again a Major Focus at PCIM Europe

SiC and GaN Again a Major Focus at PCIM Europe

new products May 15, 2013 by Power Pulse1595211359
SiC Modules, IGBTs and Super-Junction MOSFETs Introduced on Day One of PCIM

SiC Modules, IGBTs and Super-Junction MOSFETs Introduced on Day One of PCIM

new products May 13, 2013 by Power Pulse1595211359
Gate Drive Optocouplers for High-Speed SiC FETs Deliver up to 2.5A

Gate Drive Optocouplers for High-Speed SiC FETs Deliver up to 2.5A

new products May 12, 2013 by Power Pulse1595211359
Vicor’s ChiP Power Component Packaging Technology to Make European Debut at PCIM

Vicor’s ChiP Power Component Packaging Technology to Make European Debut at PCIM

new products May 06, 2013 by Power Pulse1595211359
KOA Speer and Stackpole Introduce Chip Resistors

KOA Speer and Stackpole Introduce Chip Resistors

new products Apr 24, 2013 by Jeff Shepard
Dual Half-Bridge Motor Driver IC Designed for Unidirectional Drive of Two DC Motors

Dual Half-Bridge Motor Driver IC Designed for Unidirectional Drive of Two DC Motors

new products Apr 23, 2013 by Jeff Shepard
Fujitsu Semiconductor Releases Two Energy Harvesting Power Management ICs

Fujitsu Semiconductor Releases Two Energy Harvesting Power Management ICs

new products Apr 21, 2013 by Jeff Shepard
TI Unveils Gas-Gauge IC for Lead-Acid Batteries Used in UPS and E-Bikes

TI Unveils Gas-Gauge IC for Lead-Acid Batteries Used in UPS and E-Bikes

new products Apr 15, 2013 by Jeff Shepard