TDK Intros Multilayer Chip Beads that are 80% Smaller in Volume and 65% in Area
TDK Corporation has developed a miniaturized multilayer chip bead series in case size 0603 (EIA 0201) that is nearly 80 percent smaller in volume and 65 percent in area than existing MMZ1005-E types with comparable performance. The new MMZ0603-E series of multilayer chip beads combines compact dimensions of just 0.6 x 0.3 x 0.3 mm³ with excellent electrical characteristics. The MMZ0603-E series is currently available in two high-impedance versions, one rated for 600 Ω and the other for 1000 Ω at 100 MHz. Both types offer even higher impedance values at 1 GHz of 1000 Ω and 1800 Ω, respectively.
As a result of these impedance values, a single component can cover a very wide frequency range, ensuring highly efficient noise attenuation. The MMZ0603-E multilayer chip bead is therefore very well suited for eliminating noise in compact mobile devices, especially in smartphones that must operate with multiple communication frequency bands.
The significant advance in the miniaturization of chip beads was made possible by TDK’s Gigaspira® production technology, which creates a micro-coil winding that is perpendicular to the terminal electrodes, effectively suppressing stray capacitance from the terminals. With the new high-performance MMZ0603-E series in case size 0603, which is fast becoming the dominant form factor for passive components in smartphones, TDK is meeting these market needs. Mass production started in February 2013.
