North Carolina-based power device manufacturer Cree is refreshing its brand identity and signing a new supply deal with GM.
North Carolina-based power device manufacturer Cree is refreshing its brand identity and signing a new supply deal with GM.
Japanese silicon-carbide wafer provider Showa Denko recently signed a pair of long-term supply agreements with ROHM and Toshiba.
Japanese silicon-carbide wafer provider Showa Denko recently signed a pair of long-term supply agreements with ROHM and Toshiba.
The unit offers a 300mA battery charger, three independent power rails, and a separate LDO output.
The unit offers a 300mA battery charger, three independent power rails, and a separate LDO output.
This article proposes a method to obtain optimal properties of silicon fast IGBT chips designed for joint operation with…
This article proposes a method to obtain optimal properties of silicon fast IGBT chips designed for joint operation with SiC SBD in hybrid modules.…
HVCB High Voltage Precision Chip Resistors Offer 0.1% Tolerance and 25 ppm TCR.
HVCB High Voltage Precision Chip Resistors Offer 0.1% Tolerance and 25 ppm TCR.
Their goals are to improve efficiencies in the design and testing validation of GaN and SiC semiconductors.
Their goals are to improve efficiencies in the design and testing validation of GaN and SiC semiconductors.
The first series member is a highly integrated half-bridge device aimed at wireless charging applications.
The first series member is a highly integrated half-bridge device aimed at wireless charging applications.
The isolated, 1.5W DC/DC device employs a tiny internal planar transformer to cut power solution sizes in half for EVS and HEVs.
The isolated, 1.5W DC/DC device employs a tiny internal planar transformer to cut power solution sizes in half for EVS and HEVs.
New device completes Microchip’s family of Vref products providing increased reliability and AEC-Q100 qualification.
New device completes Microchip’s family of Vref products providing increased reliability and AEC-Q100 qualification.
The new unit features multiple levels of control, affording a high level of protection for SiC MOSFETs and the systems they power.
The new unit features multiple levels of control, affording a high level of protection for SiC MOSFETs and the systems they power.
Researchers develop microbatteries that are as thick as three sheets of paper, and can be embedded into sensor circuitry.
Researchers develop microbatteries that are as thick as three sheets of paper, and can be embedded into sensor circuitry.
The SD11900 series maximizes power density while minimizing loop inductance with a pin configuration to allow simple…
The SD11900 series maximizes power density while minimizing loop inductance with a pin configuration to allow simple power bussing.
X-FAB Semiconductor Foundries announces completion of a licensing agreement with X-Celeprint and becomes world’s first…
X-FAB Semiconductor Foundries announces completion of a licensing agreement with X-Celeprint and becomes world’s first foundry to offer…
The new package enables EM/IR assessment of analog, digital, and mixed-signal IC designs of any size before committing to silicon.
The new package enables EM/IR assessment of analog, digital, and mixed-signal IC designs of any size before committing to silicon.
The new design is fully customizable and will reduce time to market for a variety of high-power applications.
The new design is fully customizable and will reduce time to market for a variety of high-power applications.
Central Semiconductor Corp., introduces its CAK3-012C & CAK6-042C series of 5G bi-directional transient voltage…
Central Semiconductor Corp., introduces its CAK3-012C & CAK6-042C series of 5G bi-directional transient voltage suppressors (TVS).
AEC-Q200 Qualified Device Saves Board Space While Lowering Component Counts and Placement Costs.
AEC-Q200 Qualified Device Saves Board Space While Lowering Component Counts and Placement Costs.
Junction temperature is directly related to system reliability. With TO packaged transistors, it was possible to add a…
Junction temperature is directly related to system reliability. With TO packaged transistors, it was possible to add a thermocouple to the case and…
The collaboration will see GaN Systems supply BMW Group with high-performance, automotive-grade GaN power transistors.
The collaboration will see GaN Systems supply BMW Group with high-performance, automotive-grade GaN power transistors.
MAX77659 SIMO PMIC with built-in switching charger reduces bill of materials by 60 percent.
MAX77659 SIMO PMIC with built-in switching charger reduces bill of materials by 60 percent.
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