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Chip-type Ceramic Rechargeable Batteries Coming in April 2019

Chip-type Ceramic Rechargeable Batteries Coming in April 2019


News Dec 16, 2018 by Paul Shepard
Carbon-Doping Free GaN-on-Si Displays Better Dynamic R(on)

Carbon-Doping Free GaN-on-Si Displays Better Dynamic R(on)


News Dec 14, 2018 by Paul Shepard
How Long will Your System Last A Discrete IGBT Reliability Study

How Long will Your System Last A Discrete IGBT Reliability Study

High quality and reliability are among the key aspects in the design of a power semiconductor. The influence of these parameters is evident since they


H-bridge Driver IC Supporting 1.8V Low-Voltage and 4.0A Current Drive

H-bridge Driver IC Supporting 1.8V Low-Voltage and 4.0A Current Drive

GaN Enables Small & Fast USB Wall-Mount Chargers

GaN Enables Small & Fast USB Wall-Mount Chargers

Vertical Ga2O3 Power FET Produced with Low-Cost, Highly-Manufacturable Ion Implantation Doping Process

Vertical Ga2O3 Power FET Produced with Low-Cost, Highly-Manufacturable Ion Implantation Doping Process


News Dec 13, 2018 by Paul Shepard
Transphorm Ships Over a Quarter of a Million GaN Power Devices

Transphorm Ships Over a Quarter of a Million GaN Power Devices


News Dec 13, 2018 by Paul Shepard
Thick-Film Chip Resistors Deliver Industry-Leading TCR Characteristics

Thick-Film Chip Resistors Deliver Industry-Leading TCR Characteristics

Automotive Data Flow Processor Test Chip Announced by NSITEXE

Automotive Data Flow Processor Test Chip Announced by NSITEXE


News Dec 13, 2018 by Paul Shepard
Flip Chip Schottky Diode in Low-Profile WLCSP

Flip Chip Schottky Diode in Low-Profile WLCSP

GaN-Enabled Wirelessly Powered Systems for the Home and High-Resolution LiDAR

GaN-Enabled Wirelessly Powered Systems for the Home and High-Resolution LiDAR


News Dec 12, 2018 by Paul Shepard
7th Gen NX Type Converter Inverter Brake Modules

7th Gen NX Type Converter Inverter Brake Modules

Applications such as elevator drives or servomotors have several special requirements. One on hand, high efficiency is important, while on the…


High-Current IGBT Gate Driver with Active Miller Clamp

High-Current IGBT Gate Driver with Active Miller Clamp

28GHz GaN Front-End Module Targets 5G Rollout

28GHz GaN Front-End Module Targets 5G Rollout

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package

World’s First Industrial-Grade eSIM in Wafer-Level Chip-Scale Package


News Dec 10, 2018 by Paul Shepard
Phase-Change Memory Now Sampling for Automotive Microcontrollers

Phase-Change Memory Now Sampling for Automotive Microcontrollers


News Dec 10, 2018 by Paul Shepard
GaN Enables 14mm-Thin 45W Wall Charger

GaN Enables 14mm-Thin 45W Wall Charger

650V D-Mode GaN HEMTs Produced on 200mm Gan-on-Si Wafers with CMOS-Compatible Process

650V D-Mode GaN HEMTs Produced on 200mm Gan-on-Si Wafers with CMOS-Compatible Process


News Dec 06, 2018 by Paul Shepard
New Mechanism for Enhancing Reliability of SiC Power Devices Detailed at IEDM

New Mechanism for Enhancing Reliability of SiC Power Devices Detailed at IEDM


News Dec 06, 2018 by Paul Shepard
IEEE Energy Conversion Congress and Expo 2018

IEEE Energy Conversion Congress and Expo 2018

Energy Conversion Congress and Expo (ECCE)—the foremost IEEE conference in the field of electrical and electromechanical energy…


tech insights Dec 05, 2018 by Gary Dolny