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First Ionically-Cooled, Wireless Charger Demonstrated at CES 2019

First Ionically-Cooled, Wireless Charger Demonstrated at CES 2019


News Jan 11, 2019 by Scott McMahan
The Efficiency Revolution: Migrating to Advanced Low-Standby Power Architectures

The Efficiency Revolution: Migrating to Advanced Low-Standby Power Architectures

This article discusses the optimization of advancing to low-standby power architectures.


Making GaN Power Electronics Universal

Making GaN Power Electronics Universal

This article focuses on how GaNPower International Inc. is able to make GaN easier to use and more universal.


AI and Digitally-Controlled Ultra-Wideband GaN RF Amplifier for Mobile Base Stations

AI and Digitally-Controlled Ultra-Wideband GaN RF Amplifier for Mobile Base Stations


News Jan 10, 2019 by Scott McMahan
Wide Terminal Low-Ohmic High Power Thick-Film Chip Resistor

Wide Terminal Low-Ohmic High Power Thick-Film Chip Resistor

ROHM has recently announced the availability of a new lineup of high power wide terminal thick-film chip resistors (10-910mΩ) ideal for current…


new products Jan 09, 2019 by ROHM
Cree and STMicroelectronics Announce MultiYear Silicon Carbide Wafer Supply Agreement

Cree and STMicroelectronics Announce MultiYear Silicon Carbide Wafer Supply Agreement

Cree, Inc. recently announced that it signed a multi-year agreement to produce and supply its Wolfspeed® silicon carbide (SiC) wafers to…


new products Jan 09, 2019 by Cree
Reverse conducting IGBT with protecting features delivers innovative solution for induction heating applications

Reverse conducting IGBT with protecting features delivers innovative solution for induction heating applications

Infineon Technologies AG is introducing the TRENCHSTOP™ Feature IGBT Protected Series for Induction Heating. Compared to a standard RC-H5 reverse…


IGSS GaN and SilTerra Demonstrate Powerful New Technology to  Unlock US12 Billion Semiconductor Opportunity

IGSS GaN and SilTerra Demonstrate Powerful New Technology to Unlock US12 Billion Semiconductor Opportunity

IGSS GaN (IGaN) and SilTerra Malaysia Sdn. Bhd. are pleased to announce the impressive results of their recent technology transfer partnership,…


new products Jan 09, 2019 by IGSS GaN
Proton-Electrotex Visits the Official Distributor in Japan

Proton-Electrotex Visits the Official Distributor in Japan

Proton-Electrotex paid a visit to Japan kindly assisted by the Eich Corporation, the official representative of the company in the region.


Nexperia and Avnet Celebrate 50 Years of Success

Nexperia and Avnet Celebrate 50 Years of Success

Nexperia and global technology solutions provider Avnet announces it is celebrating a half-century of successfully working together with strong…


tech insights Jan 09, 2019 by Nexperia
Wide Terminal Low-Ohmic High Power Thick-Film Chip Resistor

Wide Terminal Low-Ohmic High Power Thick-Film Chip Resistor

ROHM announced the availability of a new lineup of high power wide terminal thick-film chip resistors ideal for current detection in a variety of…


Technical Articles Jan 09, 2019 by ROHM
GaN-Based Conduction Cooled AC-DCs Pack 504W in 4” x 2.4” Footprint

GaN-Based Conduction Cooled AC-DCs Pack 504W in 4” x 2.4” Footprint

1350V, 20A IGBT with Integrated Gate Driver Targets Induction Heating Designs

1350V, 20A IGBT with Integrated Gate Driver Targets Induction Heating Designs

Cree Agrees to Supply STMicroelectronics with SiC Wafers

Cree Agrees to Supply STMicroelectronics with SiC Wafers


News Jan 08, 2019 by Scott McMahan
GaN Enables Efficient and Compact Capacitive-Coupled Power Conversion

GaN Enables Efficient and Compact Capacitive-Coupled Power Conversion


News Jan 07, 2019 by Paul Shepard
ECPE Announces Workshops and Events for 2019

ECPE Announces Workshops and Events for 2019

ECPE recently released the program for its upcoming workshop 'New Technologies for Medium-Frequency Solid-State Transformers' taking…


tech insights Jan 07, 2019 by ECPE
Ultra-Low Power Transistors Shown to Be Possible with Unique Material

Ultra-Low Power Transistors Shown to Be Possible with Unique Material


News Jan 04, 2019 by Paul Shepard
Osram and GaN Systems Develop Ultrafast and High-Power Laser Driver for LiDAR

Osram and GaN Systems Develop Ultrafast and High-Power Laser Driver for LiDAR


News Jan 03, 2019 by Paul Shepard
Osram and GaN Systems Introduce Ultrafast Laser Driver with High-Power Multi-Channel for LiDAR

Osram and GaN Systems Introduce Ultrafast Laser Driver with High-Power Multi-Channel for LiDAR

Osram Opto Semiconductors announced an ultrafast laser driver with a high-power, multi-channel Surface Mount (SMT) laser for LiDAR (light detection…


Schurter Announces UAI 1206 a Chip Fuse for High Demands

Schurter Announces UAI 1206 a Chip Fuse for High Demands

With the UAI 1206, SCHURTER offers a pulse and temperature resistant chip fuse with slow release characteristics for applications in which aging…