The new driver features dual 10 amp source and sink drive capabilities and an integrated thermal pad to reduce junction to case thermal resistance
The new driver features dual 10 amp source and sink drive capabilities and an integrated thermal pad to reduce junction to case thermal resistance
This article highlights Infineon Technologies AG 650 V CoolSiC™ Hybrid IGBT portfolio in a discrete package with 650 V…
This article highlights Infineon Technologies AG 650 V CoolSiC™ Hybrid IGBT portfolio in a discrete package with 650 V blocking voltage.
A team of researchers led by researcher Liwen Sang has developed a microelectromechanical systems (MEMS) resonator…
A team of researchers led by researcher Liwen Sang has developed a microelectromechanical systems (MEMS) resonator capable of stable operation in…
The new semiconductor is aimed at ultra-thin Point-of-Load Converters, USB-C Battery Chargers and other space-constrained…
The new semiconductor is aimed at ultra-thin Point-of-Load Converters, USB-C Battery Chargers and other space-constrained applications
The new devices are aimed at data center applications and supply 12 VDC at output powers ranging from 1.5 to 3.2 kW
The new devices are aimed at data center applications and supply 12 VDC at output powers ranging from 1.5 to 3.2 kW
This article highlights Chang Sung Corporation upgraded High Flux Core called HIGH FLUX TITANIUM Series (GT Grade) that…
This article highlights Chang Sung Corporation upgraded High Flux Core called HIGH FLUX TITANIUM Series (GT Grade) that is specialized in server…
ROHM Semiconductor recently wrapped up construction on a new five-floor SiC power device factory that sources 100% of its…
ROHM Semiconductor recently wrapped up construction on a new five-floor SiC power device factory that sources 100% of its electricity from…
The new device enables the fastest wireless charging for smartphones, notebooks and laptops.
The new device enables the fastest wireless charging for smartphones, notebooks and laptops.
The GS-EVB-HB-66508B-RN and the GS-EVB-HB-66516T-RN are half bridge daughter cards that can handle 3kW and 6kW, respectively
The GS-EVB-HB-66508B-RN and the GS-EVB-HB-66516T-RN are half bridge daughter cards that can handle 3kW and 6kW, respectively
Learn about the electrostatic discharge (ESD) events, component ESD qualification tests, and the ESD protection…
Learn about the electrostatic discharge (ESD) events, component ESD qualification tests, and the ESD protection strategies commonly employed in ICs.
This article discusses practical considerations for the measurement and extraction of dynamic power semiconductor parameters.
This article discusses practical considerations for the measurement and extraction of dynamic power semiconductor parameters.
MinDCet has implemented GaN Systems’ enhancement-mode, (e-mode) gallium-nitride (GaN) high-electron-mobility…
MinDCet has implemented GaN Systems’ enhancement-mode, (e-mode) gallium-nitride (GaN) high-electron-mobility transistors (HEMTs) into…
From a list of three nominees, the Global Semiconductor Alliance announced Vicor as the 2020 GSA Award for Analyst…
From a list of three nominees, the Global Semiconductor Alliance announced Vicor as the 2020 GSA Award for Analyst Favorite Semiconductor Company.
By implementing Efficient Power Conversion’s (EPC) Gallium-Nitride (GaN) transistors, BrightLoop Converters’ DC-DC…
By implementing Efficient Power Conversion’s (EPC) Gallium-Nitride (GaN) transistors, BrightLoop Converters’ DC-DC Buck Converter looks to…
The new power converter is available in a 33 x 22.9 mm 16th brick package and achieves efficiency levels of 95% and better
The new power converter is available in a 33 x 22.9 mm 16th brick package and achieves efficiency levels of 95% and better
Infineon Technologies broadens its EiceDRIVER™ portfolio with the new 24 V dual-channel low side gate driver with an…
Infineon Technologies broadens its EiceDRIVER™ portfolio with the new 24 V dual-channel low side gate driver with an integrated thermal pad
This article highlights TDK 3D design techniques that can help reduce parasitic losses, and improve thermal performance…
This article highlights TDK 3D design techniques that can help reduce parasitic losses, and improve thermal performance while also reducing the PCB…
The new EiceDRIVER X3s offer active shutdown, short circuit clamping as well as either an active Miller Clamp or…
The new EiceDRIVER X3s offer active shutdown, short circuit clamping as well as either an active Miller Clamp or separate source and sink outputs
Power electronics manufacturer Navitas Semiconductor and Dell Technologies have partnered on the development of new…
Power electronics manufacturer Navitas Semiconductor and Dell Technologies have partnered on the development of new gallium nitride (GaN)…
Here’s what three of the top players in the power electronics industry had to unveil at the all-digital CES 2021.
Here’s what three of the top players in the power electronics industry had to unveil at the all-digital CES 2021.
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