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JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

 JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices


new products Mar 01, 2019 by JEDEC
EMI Application Mode Added to Spectrum Analyzers for Pre-Compliance Analysis

EMI Application Mode Added to Spectrum Analyzers for Pre-Compliance Analysis

15W/20W/30W DC-DC Converters Optimized to Drive LDOs

15W/20W/30W DC-DC Converters Optimized to Drive LDOs

100% Capacity Utilization from Zinc Bromine Energy Storage

100% Capacity Utilization from Zinc Bromine Energy Storage

Eval Kit for 6A Scalable / Programmable DC-DC Modules

Eval Kit for 6A Scalable / Programmable DC-DC Modules

Toshiba Launches Single-Supply Single-Gate Logic Devices Supporting Low Voltage Operation

Toshiba Launches Single-Supply Single-Gate Logic Devices Supporting Low Voltage Operation

Toshiba Electronics Europe GmbH today announced their range of single-supply single-gate logic devices.


Exxelia Introduces a New Filter Design Strategy Optimized for HEMP Applications at EMV 2019

Exxelia Introduces a New Filter Design Strategy Optimized for HEMP Applications at EMV 2019

Exxelia, a leading global designer and manufacturer of highly engineered passive components and high-end electromechanical solutions, will exhibit…


new products Feb 28, 2019 by EXXELIA
Bluetooth Low-Energy, Wireless Multi-Core SoCs for IoT and Wearables

Bluetooth Low-Energy, Wireless Multi-Core SoCs for IoT and Wearables

High-Speed / High-Voltage Gate Drivers Operate up to 200V

High-Speed / High-Voltage Gate Drivers Operate up to 200V

Polymeric TCO Devices Protect USB-C Against Thermal Runaway

Polymeric TCO Devices Protect USB-C Against Thermal Runaway

Anisotropic Magneto Resistive Current Sensors Handle up to ±50A

Anisotropic Magneto Resistive Current Sensors Handle up to ±50A

Ultra-Low Power PMIC for Thermally-Based Energy Harvesting

Ultra-Low Power PMIC for Thermally-Based Energy Harvesting

Würth Elektronik eiSos Opens New Building of the Quality Design Center in Shenzhen

Würth Elektronik eiSos Opens New Building of the Quality Design Center in Shenzhen

On February 20, 2019, Prof. Dr. h. c. mult. Reinhold Würth opened the new site of the Würth Elektronik eiSos Quality Design Center (QDC) in the…


8A SiC MOSFET Gate Driver Supports Inverters of Several Hundred kW

8A SiC MOSFET Gate Driver Supports Inverters of Several Hundred kW

Ultra-Low Power MCU with Sub-GHz Radio and Long Battery Life

Ultra-Low Power MCU with Sub-GHz Radio and Long Battery Life

Dual-Core Wireless MCUs Support Bluetooth 5, Thread, and Zigbee 3.0

Dual-Core Wireless MCUs Support Bluetooth 5, Thread, and Zigbee 3.0

100V/3A Bipolar Transistors with 70% Smaller PCB Footprint than SOT223

100V/3A Bipolar Transistors with 70% Smaller PCB Footprint than SOT223

Flexible USB-C with Power Delivery Making Universal Power Adapters a Reality

Flexible USB-C with Power Delivery Making Universal Power Adapters a Reality

Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

Xilinx and Infineon Collaborate on Power Solutions for the Zynq UltraScale  MPSoC and RFSoC Families

Xilinx and Infineon Collaborate on Power Solutions for the Zynq UltraScale MPSoC and RFSoC Families

Xilinx Inc. and Infineon Technologies AG are jointly providing scalable power supplies for the Xilinx® Zynq® UltraScale™ + MPSoC and RFSoC…