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85V Half-Bridge MOSFET Driver with Adaptive Dead Time and Shoot-Through Protection

85V Half-Bridge MOSFET Driver with Adaptive Dead Time and Shoot-Through Protection

new products Jan 07, 2014 by Jeff Shepard
P-Channel Gen III MOSFET Features 0.0016-Ohm On-resistance

P-Channel Gen III MOSFET Features 0.0016-Ohm On-resistance

new products Jan 07, 2014 by Jeff Shepard
IdealPoE Diode Bridge Integrates Low-Loss MOSFET Base Bridges and Controller

IdealPoE Diode Bridge Integrates Low-Loss MOSFET Base Bridges and Controller

new products Jan 01, 2014 by Jeff Shepard
Mitsubishi to Launch Railcar Traction Inverter with All-SiC Power Module

Mitsubishi to Launch Railcar Traction Inverter with All-SiC Power Module

new products Dec 25, 2013 by Jeff Shepard
High-Temperature SiC Junction Transistors in Hermetic Packages

High-Temperature SiC Junction Transistors in Hermetic Packages

new products Dec 15, 2013 by Jeff Shepard
Solderable and Sinterable Top-Side Bonding for High-Power IGBT Wafers

Solderable and Sinterable Top-Side Bonding for High-Power IGBT Wafers

new products Dec 15, 2013 by Jeff Shepard
Asymmetric Package Optimizes Low-Side MOSFET RDS(on) for Synchronous DC-DCs

Asymmetric Package Optimizes Low-Side MOSFET RDS(on) for Synchronous DC-DCs

new products Dec 12, 2013 by Jeff Shepard
Split-Output Topology Improves Dynamic Behavior in SiC MOSFET Modules

Split-Output Topology Improves Dynamic Behavior in SiC MOSFET Modules

new products Dec 05, 2013 by Jeff Shepard
-20V P-Channel Gen III MOSFET is First in CSP MICRO FOOT Package

-20V P-Channel Gen III MOSFET is First in CSP MICRO FOOT Package

new products Dec 03, 2013 by Jeff Shepard
SiC Schottky Diodes in SMB (DO-214) packages offer smallest footprints

SiC Schottky Diodes in SMB (DO-214) packages offer smallest footprints

new products Nov 18, 2013 by Jeff Shepard
Amantys brings Insight and Performance Monitoring to IGBT Module Systems

Amantys brings Insight and Performance Monitoring to IGBT Module Systems

new products Nov 14, 2013 by Jeff Shepard
Toshiba Adds Three Miniature Packages to Automotive MOSFET Portfolio

Toshiba Adds Three Miniature Packages to Automotive MOSFET Portfolio

new products Nov 11, 2013 by Jeff Shepard
Silicon Carbide Bare Die up to 8000V from GeneSiC

Silicon Carbide Bare Die up to 8000V from GeneSiC

new products Nov 06, 2013 by Jeff Shepard
High-Speed Four-Channel MOSFET Driver Optimized for Medical Ultrasound Applications

High-Speed Four-Channel MOSFET Driver Optimized for Medical Ultrasound Applications

new products Nov 04, 2013 by Jeff Shepard
IXYS Releases New 600A 650V IGBT Module Based On XPT IGBT Technology

IXYS Releases New 600A 650V IGBT Module Based On XPT IGBT Technology

new products Oct 29, 2013 by Jeff Shepard
Toshiba Adds Lower-Current Devices to SiC Schottky Offering

Toshiba Adds Lower-Current Devices to SiC Schottky Offering

new products Oct 23, 2013 by Jeff Shepard
High-Speed IGBT H-Bridge Modules Built to Boost Performance

High-Speed IGBT H-Bridge Modules Built to Boost Performance

new products Oct 20, 2013 by Jeff Shepard
650V SiC Schottky Improves Performance in High-power Industrial Applications

650V SiC Schottky Improves Performance in High-power Industrial Applications

new products Oct 14, 2013 by Jeff Shepard
Silicon Labs Claims most Energy-Friendly MCUs Based on the ARM Cortex-M0+ Core

Silicon Labs Claims most Energy-Friendly MCUs Based on the ARM Cortex-M0+ Core

new products Oct 08, 2013 by Jeff Shepard
EPC Dev. Board Features Optimal Layout of Paralleled GaN FETs for Higher Currents

EPC Dev. Board Features Optimal Layout of Paralleled GaN FETs for Higher Currents

new products Oct 02, 2013 by Jeff Shepard