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Hesse Mechatronics Partners with CAD Design Software

Hesse Mechatronics Partners with CAD Design Software

Hesse Mechatronics announces that the company recently partnered with CAD Design Software


PMICs Optimized for Intel’s Skylake Core Processor Architecture

PMICs Optimized for Intel’s Skylake Core Processor Architecture

New Design & Application Center in Barcelona

New Design & Application Center in Barcelona

Würth Elektronik eiSos is increasing its presence on the Spanish market with the opening of the new Design & Application Centre in Barcelona


First Qi-Certified Medium Power Transmitter Reference Design

First Qi-Certified Medium Power Transmitter Reference Design

ROHM has received certification from WPC (Wireless Power Consortium) for its reference design using the BD57020MWV wireless power transmitter IC. This


new products Dec 01, 2015 by ROHM
Inductive Sensor Interface ICs Based on LVDT Architecture

Inductive Sensor Interface ICs Based on LVDT Architecture

Thermal Cycling for Power Device Circuit Design

Thermal Cycling for Power Device Circuit Design

The integration of rapid temperature cycling with the Keysight B1506A Power Device Analyzer has been introduced by inTEST Thermal Solutions and…


Quick Charge 3.0 Compliant Charger Reference Design

Quick Charge 3.0 Compliant Charger Reference Design

Cubic Design for Axial Electrolytic Capacitors

Cubic Design for Axial Electrolytic Capacitors

The Husum-based capacitor expert FTCAP demonstrates, however, that this does not necessarily have to be the case: the new cubic design offers…


new products Aug 01, 2015 by FTCAP
Frame Core Power Line Chokes with Vertical Design

Frame Core Power Line Chokes with Vertical Design

MCUs Extend Battery Life and Simplify Antenna Circuit Design

MCUs Extend Battery Life and Simplify Antenna Circuit Design

99% Efficient Digital Inrush Current Controller Reference Design

99% Efficient Digital Inrush Current Controller Reference Design

300V FETs enable New Hard Switching Design Possibilities

300V FETs enable New Hard Switching Design Possibilities

Optimized 32bit MCU Architecture Decreases Power  Consumption

Optimized 32bit MCU Architecture Decreases Power Consumption

According to Jennifer Barry, Product Marketing Manager for MSP430 Microcontroller, Texas Instruments announced with its MSP432 microcontroller…


Integrated Architecture Power Stack Demonstrator

Integrated Architecture Power Stack Demonstrator

Mersen has shown a demo of a 280 KVA 3-phase power stack show-casing state-of-the-art integration technologies at PCIM Europe 2015 in May. Mersen…


new products Jun 01, 2015 by Mersen
MCUs for Sensor-less Brushless DC Motor Control Design

MCUs for Sensor-less Brushless DC Motor Control Design

60V Synchronous Buck Controller Simplifies Power Supply Design

60V Synchronous Buck Controller Simplifies Power Supply Design

Little Box Challenge to design cooling of a kilowatt-scale inverter

Little Box Challenge to design cooling of a kilowatt-scale inverter

Mersen has accepted Google’s “Little Box Challenge” to design a power inverter that is about 10 times smaller than what is available today.


new products May 01, 2015 by Mersen
GaN with Topside Cooling for Simpler PCB Design

GaN with Topside Cooling for Simpler PCB Design

GaN Systems Inc., a leading developer of gallium nitride power switching semiconductors, announced topside cooling technology in its wide range of…


new products May 01, 2015 by GaN Systems
Zolt set to Jolt Adapter makers with SiC-based 70W Design

Zolt set to Jolt Adapter makers with SiC-based 70W Design

GaN Power Switches with Topside Cooling Simplify PCB Design

GaN Power Switches with Topside Cooling Simplify PCB Design