New Industry Products

Hesse Mechatronics Partners with CAD Design Software

March 01, 2016 by Hesse Mechatronics

Hesse Mechatronics announces that the company recently partnered with CAD Design Software

Hesse Mechatronics, Inc., the Americas subsidiary of Hesse GmbH, world leader in wedge wire bonding technology for power, automotive, medical, aerospace, RF, microwave, opto, military and consumer electronics, announces that the company recently partnered with CAD Design Software. 

The Hesse Mechatronics Utility Module creates an XML data file that contains wire bond information of polylines in a DXF/DWG file.  This XML data file can be used with Hesse Mechatronics wire bonding machines that accept XML data format. This can be done on the Hesse Mechatronics Wire Bonders BJ820, BJ935 and BJ939.

  • Multiple bond wire groups can be set with unique References.
  • Sequence numbers and direction arrows will be visible in the drawing.
  • Create individual bond wire reference blocks.
  • Update existing blocked entities such as the dies or chips with Reference points that will be included in the XML output.


About Hesse Mechatronics

Hesse GmbH is one of the world’s leading producers of fully automated Wedge-Wedge Bonders, software for monitoring ultrasonic-bond-processes, ultrasonic Flip-Chip Bonders as well as customized tools and machines. All relevant industrial companies engaged in assembly lean production wire bonder and connection technology (semiconductor manufacturers, HF/RF, automotive, medical etc.) are among the worldwide customers of Hesse GmbH. Optimum local support for our customers, especially in the important markets such as Asia and America, is ensured by subsidiaries in Hong Kong, USA and Japan with their own Sales and Service. Furthermore, we have partner companies and co-operations in over 30 countries.