Hesse GmbH is one of the world’s leading producers of fully automated Wedge-Wedge Bonders, software for monitoring ultrasonic-bond-processes, ultrasonic Flip-Chip Bonders as well as customized tools and machines. All relevant industrial companies engaged in assembly lean production wire bonder and connection technology (semiconductor manufacturers, HF/RF, automotive, medical etc.) are among the worldwide customers of Hesse GmbH. Optimum local support for our customers, especially in the important markets such as Asia and America, is ensured by subsidiaries in Hong Kong, USA and Japan with their own Sales and Service. Furthermore, we have partner companies and co-operations in over 30 countries.