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Henkel’s Technomelt Low Pressure Molding Technology Meets Demands for Encapsulation of Electronics

Henkel’s Technomelt Low Pressure Molding Technology Meets Demands for Encapsulation of Electronics

Henkel’s Technomelt Low Pressure Molding technology meets latest demands for encapsulation of electronics and medical components


Transphorm and Silana Partner on GaN Adapter Reference Design

Transphorm and Silana Partner on GaN Adapter Reference Design

The resulting open frame, 65W USB-C PD charger unites Silana’s PWM controller with Transphorm’s SuperGaN FETs


Trinamic’s Open-Source Reference Design Shrinks and Speeds Development of End-of-Arm Tooling

Trinamic’s Open-Source Reference Design Shrinks and Speeds Development of End-of-Arm Tooling

This article highlights Maxim Integrated TMCM-1617-GRIP-REF reference design integrates hardware-based field-oriented control (FOC) and three…


AVX Releases New UBC 550 Series Ultra-Broadband Capacitors

AVX Releases New UBC 550 Series Ultra-Broadband Capacitors

Optimized for high-performance, ultra-broadband microwave and millimeter-wave RF applications, the new UBC 550Z, 550U, and 550L Series capacitors…


TDK Announces the ASIL-B Upgrade of its 3D HAL Direct-angle Sensor Family

TDK Announces the ASIL-B Upgrade of its 3D HAL Direct-angle Sensor Family

This article highlights TDK Corporation Micronas 3D HAL® direct-angle Hall-effect sensor family, HAL 37xy (HAL 37xy, HAR 37xy and HAC 37xy)*, for…


Wurth Elektronik Releases Two THT-mountable WE-FCLP Common Mode Choke Models

Wurth Elektronik Releases Two THT-mountable WE-FCLP Common Mode Choke Models

This article highlights Würth Elektronik THT-mountable WE-FCLP for common-mode and differential-mode suppression, and the SMT data line and…


GaN Systems Unveils a 3kW LLC Resonant Converter Reference Design

GaN Systems Unveils a 3kW LLC Resonant Converter Reference Design

The full-bridge reference design meets and beats the 80 Plus Titanium standard for switch mode power supplies (SMPS)


MasterGaN Reference Design from STMicroelectronics Demonstrates Heatsink-Free 250W Resonant Converter

MasterGaN Reference Design from STMicroelectronics Demonstrates Heatsink-Free 250W Resonant Converter

This article highlights STMicroelectronics reference design for its MasterGaN power packages, demonstrating how the new highly integrated devices…


TDK Extends its Range of Compact SMT High-current Chokes

TDK Extends its Range of Compact SMT High-current Chokes

This article highlights TDK EPCOS ERU-SMT power inductors with the new ERU19, ERU24 and ERU27 (B82559*) series.


Littelfuse Introduces 60 Ampere Fuse Blocks with Optional Hex-Screw

Littelfuse Introduces 60 Ampere Fuse Blocks with Optional Hex-Screw

This article highlights Littelfuse hex-screw head options for its 60 Ampere models for the LFR and LFT series of fuse blocks.


Murata’s Multilayer Choke Inductors for Vehicle-mounted Power Circuits Withstand 150°C

Murata’s Multilayer Choke Inductors for Vehicle-mounted Power Circuits Withstand 150°C

This article highlights Murata Manufacturing a multilayer type inductor “LQM18DH_70” Series as a low frequency noise suppression component for…


TDK Introduces Flexible Multi-Hall-Array Sensor for High-Precision Current Sensing

TDK Introduces Flexible Multi-Hall-Array Sensor for High-Precision Current Sensing

This article highlights TDK EPCOS MKP-X2 capacitors for interference suppression.


TDK Offers Robust X2 Capacitors for High-temperature Requirements

TDK Offers Robust X2 Capacitors for High-temperature Requirements

This article highlights TDK series of EPCOS MKP-X2 capacitors for interference suppression.


Würth Elektronik Introduces New WE-HCF-2010 High-current Inductor

Würth Elektronik Introduces New WE-HCF-2010 High-current Inductor

Würth Elektronik presents innovative WE-HCF-2010 high-current inductor


Marelli to Begin Manufacturing New Full SiC Power Modules for Motorsport Applications

Marelli to Begin Manufacturing New Full SiC Power Modules for Motorsport Applications

Italian automotive manufacturer Marelli has announced the launch of a new line of power modules with a 99.5% efficiency rate for motorsport,…


Renesas’ Motor Control ICs Simplify Brushless DC  Motor Control Design

Renesas’ Motor Control ICs Simplify Brushless DC Motor Control Design

The new ICs are systems in a chip (SIPs) delivering improved motor control while saving board space and improving power efficiency by 35%


High-Density, Quarter Brick Dc-Dc Converters for Railway Applications

High-Density, Quarter Brick Dc-Dc Converters for Railway Applications

This article highlights CUI Inc. 75 and 100 watt high-density, quarter brick dc-dc series to its isolated dc-dc converter line.


Vicor’s Underwater Remote Operating Vehicles Rely On Modular Design

Vicor’s Underwater Remote Operating Vehicles Rely On Modular Design

The flexible design approach of the Video Ray series of Remote Operating Vehicles (ROV) enable quick configuration for custom missions


TDK offers compact, current-compensated ring core chokes

TDK offers compact, current-compensated ring core chokes

This article highlights series of current-compensated EPCOS double-ring core chokes for the suppression of common-mode interferences.


Bourns Announces 1210-Size Automotive Grade Common Mode Chip Inductors

Bourns Announces 1210-Size Automotive Grade Common Mode Chip Inductors

Model PAC18R series features a shaft sealing for an enhanced ingress protection level and a precise rotational feel.