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Tiny Power Components for Wireless Charging, Step Down Conversion and “Always On” Devices

Tiny Power Components for Wireless Charging, Step Down Conversion and “Always On” Devices

This article introduces Texas Instruments' smallest, lowest power linear battery charger and tiny, fully integrated DC/DC power module.


Digital Power Comes of Age

Digital Power Comes of Age

This article describes the factors that have driven the evolution of distributed power architectures of HF DC-DC converter modules and offers…


Commercialization of High Voltage GaN

Commercialization of High Voltage GaN


News Dec 14, 2014 by Jeff Shepard
LLC Resonant Converter Simulation Using PLECS

LLC Resonant Converter Simulation Using PLECS

This article discusses simulation of resonant LLC converter using PLECS that permits analysis of transient effects from multiple physical domains.


Polymer Ta Chip Capacitors Offer Ultra-Low ESR

Polymer Ta Chip Capacitors Offer Ultra-Low ESR

Enhanced Trench IGBTs and Field Charge Controlled Diode: The Next Leap in IGBT and Diode Performance

Enhanced Trench IGBTs and Field Charge Controlled Diode: The Next Leap in IGBT and Diode Performance

This article discusses the future generation of IGBT modules which will employ Enhanced Trench ET-IGBTs and Field Charge Extraction and their…


0.9mm-High Fused High-CV Ta SMD Chip Capacitors

0.9mm-High Fused High-CV Ta SMD Chip Capacitors

eGaN Technology Transforming the Future

eGaN Technology Transforming the Future

This article discusses the potential of eGaN technology in various applications such as outer space, machine interface, electricity and medicine.


Developments in the AC-DC External Power Supply Market

Developments in the AC-DC External Power Supply Market

Led by a number of traditional applications within the communications, computers and consumer segments as well as a number of emerging…


December 2014 Electronics Industry Digest

December 2014 Electronics Industry Digest

Makers and startups, not tech providers, consumer goods companies or enterprises, will drive acceptance, use and growth in the Internet of Things…


MOSFET Gate Drivers Boosts Conversion Efficiency

MOSFET Gate Drivers Boosts Conversion Efficiency

Making Silicon Carbide from Agricultural Waste

Making Silicon Carbide from Agricultural Waste


News Dec 01, 2014 by Jeff Shepard
gapDRIVE Integrated Digital Gate Drivers feature On-Chip Galvanic Isolation

gapDRIVE Integrated Digital Gate Drivers feature On-Chip Galvanic Isolation

The Nichols Chart  the Practical Tool for Design and Test

The Nichols Chart the Practical Tool for Design and Test

This article presented the Nichols Chart, invented by Nathaniel Nichols in 1947, as the superior practical method for feedback loop design and test.


InDUR Nonlinear and SiFe – Special AC Filter and DC Power Inductors

InDUR Nonlinear and SiFe – Special AC Filter and DC Power Inductors

This article discusses the new applications of the thermally optimized STS InDUR inductors are presented and offers method to optimize the…


Gate Driver Board and SPICE Models for SiC Junction Transistors

Gate Driver Board and SPICE Models for SiC Junction Transistors


News Nov 20, 2014 by Jeff Shepard
High-Voltage IC Building Blocks Simplify SMPS Design

High-Voltage IC Building Blocks Simplify SMPS Design

Bond Buffer – Increase Power Density and Lifetime without Changing the System

Bond Buffer – Increase Power Density and Lifetime without Changing the System

This article discusses Danfoss Bond Buffer Technology and its impact on improving power density and lifetime of power modules without changing the…


AEC-Q200-Qualified Thin Film Chip Resistors

AEC-Q200-Qualified Thin Film Chip Resistors

High Power Density Dual  nHPD2 Packaging Generation

High Power Density Dual nHPD2 Packaging Generation

This article introduces Hitachi's nHPD2 and its benefits in terms of market potential, performance, modularity and ease of transition.