Announced at APEC 2024, the highly integrated family of devices reduces package size and increases power density for designers.
Announced at APEC 2024, the highly integrated family of devices reduces package size and increases power density for designers.
Infineon has entered into a strategic collaboration with Honda to develop semiconductor solutions for cars. The company…
Infineon has entered into a strategic collaboration with Honda to develop semiconductor solutions for cars. The company has also secured a key…
In this interview, Bodo drills down on how integrated current sensors enable accurate sensing in inverters and motor drives.
In this interview, Bodo drills down on how integrated current sensors enable accurate sensing in inverters and motor drives.
Infineon’s family of solid-state isolators features a coreless transformer capable of delivering faster and more…
Infineon’s family of solid-state isolators features a coreless transformer capable of delivering faster and more reliable switching and…
Freight transportation, off-road and industrial vehicles, marine applications, and aviation contribute more than 55% of…
Freight transportation, off-road and industrial vehicles, marine applications, and aviation contribute more than 55% of the total greenhouse gas…
The company is demonstrating the new GaN power stages and DC-DC modules at APEC.
The company is demonstrating the new GaN power stages and DC-DC modules at APEC.
This article explores the differences between GaN FETs and silicon MOSFETs, provides recommendations for using generic…
This article explores the differences between GaN FETs and silicon MOSFETs, provides recommendations for using generic gate drivers with GaN FETs,…
Wolfspeed has expanded agreements with Infineon and another leading global semiconductor manufacturer to supply 150 mm…
Wolfspeed has expanded agreements with Infineon and another leading global semiconductor manufacturer to supply 150 mm silicon carbide (SiC) wafers…
Part 1 of this series explains timing factors and solutions for reducing power while maintaining precision in low-power…
Part 1 of this series explains timing factors and solutions for reducing power while maintaining precision in low-power systems, as required for…
The data center of the future—the AI factory—runs on thousands of AI accelerators, each of which consumes over 1000…
The data center of the future—the AI factory—runs on thousands of AI accelerators, each of which consumes over 1000 A. Creating a green AI…
This article reviews GaN FET technologies and topologies and how GaN FET performance can reach the next level.
This article reviews GaN FET technologies and topologies and how GaN FET performance can reach the next level.
The XPH8R316MC and XPH13016MC power MOSFETs exhibit improved on-state resistance compared to previous generations.
The XPH8R316MC and XPH13016MC power MOSFETs exhibit improved on-state resistance compared to previous generations.
AOS’ DFN 5x6 double-sided cooling package promises to overcome the challenge of cooling power MOSFETs in power electronics.
AOS’ DFN 5x6 double-sided cooling package promises to overcome the challenge of cooling power MOSFETs in power electronics.
This article examines the reasons GaN power devices work for power conversion applications in space and how their…
This article examines the reasons GaN power devices work for power conversion applications in space and how their resistance to radiation makes…
This article compares baseplate and baseplate-less power modules in terms of mechanical, electrical, and thermal performance.
This article compares baseplate and baseplate-less power modules in terms of mechanical, electrical, and thermal performance.
Reference designs from Power Integrations explore the capabilities of the LinkSwitch-XT2SR family of switching supply…
Reference designs from Power Integrations explore the capabilities of the LinkSwitch-XT2SR family of switching supply controllers in smart meters…
The FETs use Transphorm’s GaN-on-Silicon substrate technology.
The FETs use Transphorm’s GaN-on-Silicon substrate technology.
A new generation of GaN devices pushes the envelope in terms of efficiency, power density, and response.
A new generation of GaN devices pushes the envelope in terms of efficiency, power density, and response.
IC designers can now securely share thermal models across the supply chain—without compromising critical details of…
IC designers can now securely share thermal models across the supply chain—without compromising critical details of chip architecture.
Two major companies make acquisitions impacting wide bandgap semiconductors and software-defined vehicle technology for…
Two major companies make acquisitions impacting wide bandgap semiconductors and software-defined vehicle technology for electric vehicles.
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