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ROHM Forms New Joint Venture for SiC Power Devices

ROHM Forms New Joint Venture for SiC Power Devices

Japanese electronic components manufacturer ROHM is forming a new joint venture to head its SiC power module business.


News Nov 09, 2021 by Shannon Cuthrell
NexWafe Raises Funds for its Low-Cost Green Silicon Wafer Technology

NexWafe Raises Funds for its Low-Cost Green Silicon Wafer Technology

NexWafe receives €39 million in funding to further develop its green solar wafer technology for large-scale production.


News Nov 01, 2021 by Stephanie Leonida
NIST Researchers Develop a New Method to Detect Faulty Transistors on Chips

NIST Researchers Develop a New Method to Detect Faulty Transistors on Chips

NIST Researchers and collaborators developed a new technique to determine faulty semiconductor devices and that can also count the number of…


News Oct 25, 2021 by Darshil Patel
University of Arkansas Receives Grant for New SiC-Based Semiconductor Fabrication Facility

University of Arkansas Receives Grant for New SiC-Based Semiconductor Fabrication Facility

Researchers from the University of Arkansas receive a $17.87 million grant from the National Science Foundation to build and run a fabrication…


News Oct 21, 2021 by Stephanie Leonida
Infineon to Boost Investment in Semiconductor Technologies in the Year Ahead

Infineon to Boost Investment in Semiconductor Technologies in the Year Ahead

Chip giant Infineon is planning a significant boost to its investments in factory expansions over the next year.


News Oct 19, 2021 by Shannon Cuthrell
Cree Rebrands to Wolfspeed and Lands Supply Agreement with GM

Cree Rebrands to Wolfspeed and Lands Supply Agreement with GM

North Carolina-based power device manufacturer Cree is refreshing its brand identity and signing a new supply deal with GM.


News Oct 18, 2021 by Shannon Cuthrell
Showa Denko Enters into Supply Agreements with ROHM and Toshiba

Showa Denko Enters into Supply Agreements with ROHM and Toshiba

Japanese silicon-carbide wafer provider Showa Denko recently signed a pair of long-term supply agreements with ROHM and Toshiba.


News Oct 14, 2021 by Shannon Cuthrell
Embedding Microbatteries On-chip for Greater Miniaturization

Embedding Microbatteries On-chip for Greater Miniaturization

Researchers develop microbatteries that are as thick as three sheets of paper, and can be embedded into sensor circuitry.


News Oct 05, 2021 by Darshil Patel
X-FAB Becomes World’s First Foundry to Offer High-Volume Micro-Transfer Printing

X-FAB Becomes World’s First Foundry to Offer High-Volume Micro-Transfer Printing

X-FAB Semiconductor Foundries announces completion of a licensing agreement with X-Celeprint and becomes world’s first foundry to offer…


News Oct 02, 2021 by Stephanie Leonida
GaN Systems and BMW Group Enter New Semiconductor Capacity Agreement

GaN Systems and BMW Group Enter New Semiconductor Capacity Agreement

The collaboration will see GaN Systems supply BMW Group with high-performance, automotive-grade GaN power transistors.


Transphorm Acquires AFSW GaN Wafer Fab in Japan

Transphorm Acquires AFSW GaN Wafer Fab in Japan

California semiconductor manufacturer Transphorm closed its acquisition of the high-volume AFSW wafer fab in Japan.


News Sep 17, 2021 by Shannon Cuthrell
onsemi Acquires GT Advanced Technologies for $415M

onsemi Acquires GT Advanced Technologies for $415M

Onsemi is acquiring SiC materials provider GT Advanced Technologies to meet increased demand in the EV and infrastructure markets.


News Sep 09, 2021 by Shannon Cuthrell
The FlaMe Project Looks to Target More Efficient Production of Power Modules

The FlaMe Project Looks to Target More Efficient Production of Power Modules

The Fraunhofer Institute of Silicon Technology (ISIT) in Germany has recently announced a new research project for designing and implementing…


Cree and STMicroelectronics Update, Expand Their SiC Wafer Supply Deal

Cree and STMicroelectronics Update, Expand Their SiC Wafer Supply Deal

Cree and STMicroelectronics are expanding their supply agreement to manage higher production volumes.


News Sep 01, 2021 by Shannon Cuthrell
Backside Metallization for Power Devices

Backside Metallization for Power Devices

SPTS technologies presents advanced wafer processing solutions for backside metallization in power devices, which is critical for improving overall…


News Sep 01, 2021 by Darshil Patel
Aiming to Boost Analog Production, TI Acquires Micron’s Utah 300mm Wafer Fab

Aiming to Boost Analog Production, TI Acquires Micron’s Utah 300mm Wafer Fab

Texas Instruments acquires Micron’s 300-mm wafer fabrication facility for $1.5 billion, a hefty investment to boost its production capacity.


News Aug 25, 2021 by Shannon Cuthrell
ON Semiconductor Rebrands and Sets Sights on New Sustainability Efforts

ON Semiconductor Rebrands and Sets Sights on New Sustainability Efforts

Changing its name to onsemi, Arizona-based power giant ON Semiconductor announced plans to expand its reach in the industrial and automotive…


News Aug 17, 2021 by Shannon Cuthrell
Foxconn Purchases Fab to Produce Silicon Carbide Wafer Chips

Foxconn Purchases Fab to Produce Silicon Carbide Wafer Chips

Hon Hai Technology Group, also known as Foxconn, has signed a six-inch wafer fab transaction with non-volatile memory (NVM) manufacturer Macronix.


ITEC Becomes an Independent Semiconductor Equipment Manufacturer

ITEC Becomes an Independent Semiconductor Equipment Manufacturer

Nexperia has announced that its semiconductor equipment manufacturing division ITEC is launching as a separate independent entity.


Cirrus Logic to Acquire Lion Semiconductor for $335 Million

Cirrus Logic to Acquire Lion Semiconductor for $335 Million

Cirrus Logic announces its agreement to acquire Lion Semiconductor to grow its mixed-signal business.


News Jul 27, 2021 by Stephanie Leonida