Continuing its recent moves to increase production capacity in Europe, Dutch semiconductor manufacturer Nexperia has acquired 100% ownership of the…
Continuing its recent moves to increase production capacity in Europe, Dutch semiconductor manufacturer Nexperia has acquired 100% ownership of the…
NXP Semiconductors has integrated Gallium Nitride (GaN) technology into its 5G multi-chip module platform.
NXP Semiconductors has integrated Gallium Nitride (GaN) technology into its 5G multi-chip module platform.
Researchers at the University of Bristol discovered a method to quantify electric fields with a semiconductor device…
Researchers at the University of Bristol discovered a method to quantify electric fields with a semiconductor device which would lead to the…
A semiconductor trade association and an automotive industry think tank team up for a supply chain partnership.
A semiconductor trade association and an automotive industry think tank team up for a supply chain partnership.
Nexperia is earmarking $700 million to boost production capacity at its wafer fabs and assembly facilities worldwide.
Nexperia is earmarking $700 million to boost production capacity at its wafer fabs and assembly facilities worldwide.
The German tech giant opened a new $1.2 billion wafer fab to expand its automotive chip production capacity.
The German tech giant opened a new $1.2 billion wafer fab to expand its automotive chip production capacity.
Hitachi’s High-Tech subsidiary is building a new semiconductor engineering facility in Oregon, expecting growth across…
Hitachi’s High-Tech subsidiary is building a new semiconductor engineering facility in Oregon, expecting growth across EV, autonomous driving,…
A group of scientists from Japan recently published a study on the development of a supposedly cheaper and non-toxic…
A group of scientists from Japan recently published a study on the development of a supposedly cheaper and non-toxic narrow-gap semiconductor…
The Si2 Compact Model Coalition (CMC) has announced it will fund and help institute the standardization of a SPICE model…
The Si2 Compact Model Coalition (CMC) has announced it will fund and help institute the standardization of a SPICE model for silicon carbide MOSFETs.
The Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM) in Berlin has announced a new project…
The Fraunhofer Institute for Reliability and Microintegration (Fraunhofer IZM) in Berlin has announced a new project aimed at increasing the range…
Leading semiconductor manufacturers and tech giants are pressuring lawmakers to spend $50 billion on the CHIPS for America Act.
Leading semiconductor manufacturers and tech giants are pressuring lawmakers to spend $50 billion on the CHIPS for America Act.
Navitas Semiconductor, a GaN power IC provider, is set to go public in a special purpose acquisition company (SPAC) deal…
Navitas Semiconductor, a GaN power IC provider, is set to go public in a special purpose acquisition company (SPAC) deal valued at over $1 billion.
Infineon concluded a supply contract with Japanese wafer manufacturer Showa Denko, which offers high-demand silicon…
Infineon concluded a supply contract with Japanese wafer manufacturer Showa Denko, which offers high-demand silicon carbide (SiC) material.
Silicon wafer manufacturer UniversityWafer has announced plans to build a system capable of producing power wideband…
Silicon wafer manufacturer UniversityWafer has announced plans to build a system capable of producing power wideband semiconductor materials in low…
Ferdinand-Braun-Institut (FBH), SweGaN AB, and the University of Bristol are partnering to design and manufacture new…
Ferdinand-Braun-Institut (FBH), SweGaN AB, and the University of Bristol are partnering to design and manufacture new spaceborne devices.
The expanded portfolio of intelligent power modules (IPM) includes two liquid cooled devices
The expanded portfolio of intelligent power modules (IPM) includes two liquid cooled devices
II-VI establishes its new backend processing line for conductive SiC substrates in Fuzhou, China.
II-VI establishes its new backend processing line for conductive SiC substrates in Fuzhou, China.
Infineon’s Virtual Power Conference, held May 4–6, will feature live expert panels and product demos showcasing the…
Infineon’s Virtual Power Conference, held May 4–6, will feature live expert panels and product demos showcasing the company’s latest energy…
Dutch semiconductor manufacturer Nexperia teams up with China’s United Automotive Electronic Systems Co. on a new…
Dutch semiconductor manufacturer Nexperia teams up with China’s United Automotive Electronic Systems Co. on a new program to develop GaN-based…
This year, Key Foundry’s newly developed Gen3 0.18-micron BCD process and its Gen2 0.13 micron embedded flash process…
This year, Key Foundry’s newly developed Gen3 0.18-micron BCD process and its Gen2 0.13 micron embedded flash process will be used for mass…
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