This article highlights Microchip’s 700V SiC MOSFETs, and 700V and 1200V SiC Schottky Barrier Diodes (SBDs) join its…
This article highlights Microchip’s 700V SiC MOSFETs, and 700V and 1200V SiC Schottky Barrier Diodes (SBDs) join its existing portfolio of SiC…
The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight countries…
The European cooperation project Power2Power has started. Over the coming three years, 43 partners from eight countries will research and develop…
This article highlights Tektronix launch of the 3 Series Mixed Domain Oscilloscope (MDO) and 4 Series Mixed Signal…
This article highlights Tektronix launch of the 3 Series Mixed Domain Oscilloscope (MDO) and 4 Series Mixed Signal Oscilloscope (MSO) on the market.
Rogers Corporation is pleased to introduce TC350 Plus laminates — ceramic filled PTFE-based woven glass reinforced…
Rogers Corporation is pleased to introduce TC350 Plus laminates — ceramic filled PTFE-based woven glass reinforced composite materials
This discuss about Littelfuse, Inc. expansion of PolySwitch® setP™ series of digital temperature indicators USB…
This discuss about Littelfuse, Inc. expansion of PolySwitch® setP™ series of digital temperature indicators USB Type‑C and USB PD charging…
Efficient Power Conversion (EPC) will provide their industry-leading gallium nitride-based power devices in wafer form…
Efficient Power Conversion (EPC) will provide their industry-leading gallium nitride-based power devices in wafer form for ease of power systems…
This article features FiDUS Power launch of the new AMC series of encapsulated PCB-mount AC-DC power supplies with range…
This article features FiDUS Power launch of the new AMC series of encapsulated PCB-mount AC-DC power supplies with range consists of 6 power level…
Infineon Technologies AG and Cypress Semiconductor Corporation today announced that the companies have signed a…
Infineon Technologies AG and Cypress Semiconductor Corporation today announced that the companies have signed a definitive agreement under which…
Dengrove Electronic Components announces the RECOM R-REF03-CAN1 reference board, which streamlines the design of an…
Dengrove Electronic Components announces the RECOM R-REF03-CAN1 reference board, which streamlines the design of an isolated CAN interface.
Miba is currently involved in an EU research project called “i-HeCoBatt” in an attempt to equip the FLEXcooler® with…
Miba is currently involved in an EU research project called “i-HeCoBatt” in an attempt to equip the FLEXcooler® with sensors so that it…
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