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New Multilayer MOV from KOA Speer Protects Against Load Dump Surge

New Multilayer MOV from KOA Speer Protects Against Load Dump Surge

FINsix Set to Unveil World’s Smallest Laptop Adapter at CES

FINsix Set to Unveil World’s Smallest Laptop Adapter at CES

Ellisys Announces USB Power Delivery Analyzer / Generator

Ellisys Announces USB Power Delivery Analyzer / Generator

Fourth-Gen HV Amplifier IC offered in Single- and Dual-Channel Designs

Fourth-Gen HV Amplifier IC offered in Single- and Dual-Channel Designs

High-Temperature SiC Junction Transistors in Hermetic Packages

High-Temperature SiC Junction Transistors in Hermetic Packages

KEMET Expands High-Voltage Surface MLCC Portfolio

KEMET Expands High-Voltage Surface MLCC Portfolio

ABB Launches Pre-Assembled High Voltage Hybrid Switchgear

ABB Launches Pre-Assembled High Voltage Hybrid Switchgear

Silabs Targets IoT with Lowest Power and Smallest Wireless MCUs

Silabs Targets IoT with Lowest Power and Smallest Wireless MCUs

Huawei Claims Most Efficient Rectifier at 98% Conversion Efficiency

Huawei Claims Most Efficient Rectifier at 98% Conversion Efficiency

Stackpole Claims Lowest Heat Rise In A 2512 Size Chip Resistor

Stackpole Claims Lowest Heat Rise In A 2512 Size Chip Resistor

Solderable and Sinterable Top-Side Bonding for High-Power IGBT Wafers

Solderable and Sinterable Top-Side Bonding for High-Power IGBT Wafers

Monitor DC Current with New DT 3-Wire Current Transducer

Monitor DC Current with New DT 3-Wire Current Transducer

2.5A Monolithic Active Cell Balancer with Telemetry Interface

2.5A Monolithic Active Cell Balancer with Telemetry Interface

1W DC-DC Converter for Industrial Automation Applications

1W DC-DC Converter for Industrial Automation Applications

Handwarmers with Smartphone Recharge

Handwarmers with Smartphone Recharge

Junction Box Meets Stringent Requirements of the Solar Industry from Amphenol

Junction Box Meets Stringent Requirements of the Solar Industry from Amphenol

TI Redefines MCU Performance in High-End Industrial Applications with Dual-Core MCUs

TI Redefines MCU Performance in High-End Industrial Applications with Dual-Core MCUs

Asymmetric Package Optimizes Low-Side MOSFET RDS(on) for Synchronous DC-DCs

Asymmetric Package Optimizes Low-Side MOSFET RDS(on) for Synchronous DC-DCs

Ericsson Third-Generation 25A Digital POL Embeds Dynamic Loop Compensation

Ericsson Third-Generation 25A Digital POL Embeds Dynamic Loop Compensation

Envelope Tracker Boosts Efficiency of CMOS Power Amplifiers in Smartphones

Envelope Tracker Boosts Efficiency of CMOS Power Amplifiers in Smartphones