Infineon Technologies AG adds a device to its cost-effective and compact-size EiceDRIVER™ 1EDN TDI (truly differential inputs) 1-channel…
Infineon Technologies AG adds a device to its cost-effective and compact-size EiceDRIVER™ 1EDN TDI (truly differential inputs) 1-channel…
By pairing the SCALE-iDriver control and safety features with its high-speed FluxLink™ communication technology, Power…
By pairing the SCALE-iDriver control and safety features with its high-speed FluxLink™ communication technology, Power Integrations delivers a…
Richardson RFPD announced the availability and full design support capabilities for a new silicon carbide module from…
Richardson RFPD announced the availability and full design support capabilities for a new silicon carbide module from Wolfspeed, a Cree Company.
Efficient Power Conversion (EPC) introduces the first of a new integrated circuit (IC) product family offering higher…
Efficient Power Conversion (EPC) introduces the first of a new integrated circuit (IC) product family offering higher performance and smaller…
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
Microchip introduces SiC SBD Modules that utilizes Microchip's newest generation of SiC die.
The Connected Lighting Platform for LED control features multiple forms of connectivity, including Bluetooth Low Energy,…
The Connected Lighting Platform for LED control features multiple forms of connectivity, including Bluetooth Low Energy, provided by the RSL10 SIP,…
ON Semiconductor has expanded its range of wide bandgap (WBG) devices with the introduction of two additional families…
ON Semiconductor has expanded its range of wide bandgap (WBG) devices with the introduction of two additional families of silicon carbide (SiC).
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