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JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

 JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices


new products Mar 01, 2019 by JEDEC
8A SiC MOSFET Gate Driver Supports Inverters of Several Hundred kW

8A SiC MOSFET Gate Driver Supports Inverters of Several Hundred kW

Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

Dynamic Characterization Platform for SiC Power MOSFETs and Schottky Diodes

Xilinx and Infineon Collaborate on Power Solutions for the Zynq UltraScale  MPSoC and RFSoC Families

Xilinx and Infineon Collaborate on Power Solutions for the Zynq UltraScale MPSoC and RFSoC Families

Xilinx Inc. and Infineon Technologies AG are jointly providing scalable power supplies for the Xilinx® Zynq® UltraScale™ + MPSoC and RFSoC…


Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

ASIL-D Real-Time Automotive MCUs with 40MB of On-Chip Memory

ASIL-D Real-Time Automotive MCUs with 40MB of On-Chip Memory

Heraeus and Toshiba Join Forces for the Development and Production of Silicon Nitride Ceramic Substrates Used in Hybrid and Electric Vehicles

Heraeus and Toshiba Join Forces for the Development and Production of Silicon Nitride Ceramic Substrates Used in Hybrid and Electric Vehicles

Heraeus Electronics, a leading provider of material solutions for the semiconductor industry and electronic packaging industry and Toshiba…


ROHM Announces New HighReliability 1608Size White Chip LED

ROHM Announces New HighReliability 1608Size White Chip LED

ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves class-leading reliability. This…


new products Feb 21, 2019 by ROHM
H-Bridge Driver IC with Integrated Arm Cortex M0 for Automotive

H-Bridge Driver IC with Integrated Arm Cortex M0 for Automotive

60V/100A N-Channel MOSFET with 1.7mΩ On-Resistance

60V/100A N-Channel MOSFET with 1.7mΩ On-Resistance

3.0kW Single-Phase Inverter GaN Evaluation Platform

3.0kW Single-Phase Inverter GaN Evaluation Platform

Vicor Introduces Four New Tightly Regulated DC-DC Converter ChiP Modules

Vicor Introduces Four New Tightly Regulated DC-DC Converter ChiP Modules

The new entries in the extensive DCM™ family are available in the 3623(36 x 23mm) ChiP (Converter housed in Package™) with an unrivaled power…


new products Feb 14, 2019 by Vicor
New Method Finds Defects in Power Transistors More Accurately Quickly and Simply

New Method Finds Defects in Power Transistors More Accurately Quickly and Simply

Transistors are needed wherever current flows, and they are an indispensable component of virtually all electronic switches. In the field of power…


STMicroelectronics to Acquire Majority Stake in Silicon Carbide Wafer Manufacturer Norstel AB

STMicroelectronics to Acquire Majority Stake in Silicon Carbide Wafer Manufacturer Norstel AB

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has signed…


6A to 20A, 650V AEC-Q101 SiC Schottky Diodes

6A to 20A, 650V AEC-Q101 SiC Schottky Diodes

5A, 30mΩ Typical Ron MOSFET Switch Protects Against ±90V Input Surges

5A, 30mΩ Typical Ron MOSFET Switch Protects Against ±90V Input Surges

40Vds GaN FETs in 20-Amp Half-Bridge Development Board

40Vds GaN FETs in 20-Amp Half-Bridge Development Board

ECPE Announces the Final Program for SiC and GaN User Forum Potential of Wide Bandgap Semiconductors in Power Electronic Applications

ECPE Announces the Final Program for SiC and GaN User Forum Potential of Wide Bandgap Semiconductors in Power Electronic Applications

ECPE is pleased to present the final program for the ECPE Workshop 'SiC & GaN User Forum: Potential of Wide Bandgap Semiconductors in…


new products Feb 07, 2019 by ECPE
Alpha and Omega Semiconductor Continues to Expand its Fifth Generation EZBuck Family

Alpha and Omega Semiconductor Continues to Expand its Fifth Generation EZBuck Family

Alpha and Omega Semiconductor Limited (AOS) today introduced  AOZ6662DI-01 and AOZ6663DI-01, high efficiency, simple-to-use synchronous buck…


3.3µF to 680µF Polymer Tantalum Molded Chip Capacitors Now in Z Case

3.3µF to 680µF Polymer Tantalum Molded Chip Capacitors Now in Z Case