Addressing the fast-growing demand for silicon carbide (SiC) solutions, Infineon Technologies launches devices in the…
Addressing the fast-growing demand for silicon carbide (SiC) solutions, Infineon Technologies launches devices in the 1200V CoolSiC™ MOSFET…
Nexperia, the global leader in discretes, logic, and MOSFET devices, today announced that in just two years as a…
Nexperia, the global leader in discretes, logic, and MOSFET devices, today announced that in just two years as a standalone company, it is…
GaN Systems announced the availability of the GS-065 low current transistor line.
GaN Systems announced the availability of the GS-065 low current transistor line.
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today…
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced a range of…
Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.
Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today…
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced the SIC1182K…
JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power…
JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices
Xilinx Inc. and Infineon Technologies AG are jointly providing scalable power supplies for the Xilinx® Zynq®…
Xilinx Inc. and Infineon Technologies AG are jointly providing scalable power supplies for the Xilinx® Zynq® UltraScale™ + MPSoC and RFSoC…
Heraeus Electronics, a leading provider of material solutions for the semiconductor industry and electronic packaging…
Heraeus Electronics, a leading provider of material solutions for the semiconductor industry and electronic packaging industry and Toshiba…
ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves…
ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves class-leading reliability. This…
The new entries in the extensive DCM™ family are available in the 3623(36 x 23mm) ChiP (Converter housed in Package™)…
The new entries in the extensive DCM™ family are available in the 3623(36 x 23mm) ChiP (Converter housed in Package™) with an unrivaled power…
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