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Digitally-Programmable Buck-Boost for Mobile Devices

Digitally-Programmable Buck-Boost for Mobile Devices

60V-Input Charger Delivers 20A for Pb-A or Li Batteries

60V-Input Charger Delivers 20A for Pb-A or Li Batteries

Fuses for Computing and Telecommunications Systems

Fuses for Computing and Telecommunications Systems

Ultra-Low Power 8-bit MCU in WLCSP32 Package

Ultra-Low Power 8-bit MCU in WLCSP32 Package

Diodes Protect Connectivity Ports and Entertainment Devices

Diodes Protect Connectivity Ports and Entertainment Devices

Current-Compensated Chokes from 0.3A to 10A

Current-Compensated Chokes from 0.3A to 10A

22V, 13.1mOhm, 4A Integrated Power Switch

22V, 13.1mOhm, 4A Integrated Power Switch

High-Permeability, Nanocrystalline Common-Mode Chokes

High-Permeability, Nanocrystalline Common-Mode Chokes

Low Input Current Drive Gate-Drive Photocouplers

Low Input Current Drive Gate-Drive Photocouplers

Drive up to 192 LEDs with Matrix FxLED Driver ICs

Drive up to 192 LEDs with Matrix FxLED Driver ICs

25V / 600mA Buck-Boost DC-DCs with 1.6µA IQ

25V / 600mA Buck-Boost DC-DCs with 1.6µA IQ

Solid-State Relays for Self-Powered IoT Devices

Solid-State Relays for Self-Powered IoT Devices

Adjustable Linear Regulators for Automotive LEDs

Adjustable Linear Regulators for Automotive LEDs

3.5- to 20-Vin DC-DC with 1.1uA IQ for USB Type-C

3.5- to 20-Vin DC-DC with 1.1uA IQ for USB Type-C

Mitsubishi Launches Super-mini Full SiC DIPIPM

Mitsubishi Launches Super-mini Full SiC DIPIPM

Hermetically-Sealed Aluminum Electrolytic Capacitors

Hermetically-Sealed Aluminum Electrolytic Capacitors

DC Link Film Capacitor for New IGBT Modules

DC Link Film Capacitor for New IGBT Modules

NXP Extends Longevity of Key LPC MCUs by 5 Years

NXP Extends Longevity of Key LPC MCUs by 5 Years

36V Ultralow Noise Precision Op Amp

36V Ultralow Noise Precision Op Amp

Digital Temperature Sensors for IoT and Wearables

Digital Temperature Sensors for IoT and Wearables