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Microchip Releases Newest Generation of AEC-Q101 Qualified 700 and 1200V Silicon Carbide (SiC) Schottky Barrier Diode

Microchip Releases Newest Generation of AEC-Q101 Qualified 700 and 1200V Silicon Carbide (SiC) Schottky Barrier Diode

Microchip releases new generation of Silicon Carbide Schottky Barrier Diode for Automotive Applications.


Tektronix Launches 1100V Parametric Testing System For Wide Bandgap Technologies in Automotive Applications

Tektronix Launches 1100V Parametric Testing System For Wide Bandgap Technologies in Automotive Applications

Tektronix’s new testing platform targets gallium nitride (GaN) and silicon carbide (SiC) based devices to design for fast switching, wide…


STMicroelectronics Acquires French Fabless Semiconductor Company SOMOS

STMicroelectronics Acquires French Fabless Semiconductor Company SOMOS

Power electronics company STMicroelectronics is acquiring France-based SOMOS Semiconductor, a power amplifier and RF specialist.


News Oct 27, 2020 by Shannon Cuthrell
GeneSiC Releases 6.5kV Silicon Carbide MOSFETs

GeneSiC Releases 6.5kV Silicon Carbide MOSFETs

This article highlights GeneSiC’s 6.5kV SiC MOSFET bare chips – G2R300MT65-CAL and G2R325MS65-CAL with full SiC modules utilizing this…


Toshiba Launches 1200V Silicon Carbide (SiC) MOSFET

Toshiba Launches 1200V Silicon Carbide (SiC) MOSFET

Toshiba Electronics Europe GmbH has launched a 1200V silicon carbide (SiC) MOSFET for high power industrial applications.


United SiC Collaborates with EDOM Technology and Macnica Inc. to Expand Product Offerings

United SiC Collaborates with EDOM Technology and Macnica Inc. to Expand Product Offerings

United SiC enter into two distribution agreements, one with EDOM Technology, and another with Macnica to expand its business across asian markets.


News Oct 09, 2020 by Stephanie Leonida
Modern Clamping Systems for Testing Power Semiconductor Devices

Modern Clamping Systems for Testing Power Semiconductor Devices

This article describes the steps of development and research carried out to design a clamping system for disc semiconductors and analyzes the…


Hard Paralleling SiC MOSFET-Based Power Modules

Hard Paralleling SiC MOSFET-Based Power Modules

The main reasons for paralleling modules are technical and these reasons become more important with SiC MOSFETs for several reasons.


Alpha and Omega Semiconductor Introduces 4-Channel Ultra-Low Capacitance Ultra-Low Clamping Voltage TVS Array

Alpha and Omega Semiconductor Introduces 4-Channel Ultra-Low Capacitance Ultra-Low Clamping Voltage TVS Array

Alpha and Omega Semiconductor introduced a series of Transient Voltage Suppressor (TVS) for high-speed line protection using the best-in-class low…


Telechips Chooses Dialog Semiconductor as its Preferred Power Management Partner

Telechips Chooses Dialog Semiconductor as its Preferred Power Management Partner

Dialog Semiconductor becomes Telechips' chosen partner for the further development of power management solutions.


News Sep 29, 2020 by Stephanie Leonida
TT Electronics Introduces New Family of Anti-Sulphur, High Reliability Thin Film Chip Resistors

TT Electronics Introduces New Family of Anti-Sulphur, High Reliability Thin Film Chip Resistors

This article highlights TT Electronics APC Series resistors with its family of high reliability surface mount resistors that have been qualified…


Alpha and Omega Semiconductor Unveils New Generation of DrMOS Power Stage

Alpha and Omega Semiconductor Unveils New Generation of DrMOS Power Stage

Alpha and Omega Semiconductor announced a new series of DrMOS targeting multiphase VR regulators powering high-performance GPU and memory in…


ON Semiconductor CEO Announces Retirement

ON Semiconductor CEO Announces Retirement

The president and CEO of one of the U.S.’s most prominent semiconductor manufacturers announced he’s stepping down to retire in May 2021.


News Sep 21, 2020 by Shannon Cuthrell
Maxim Adds Two Analog Temperature Sensor IC’s to its Essential Analog Portfolio

Maxim Adds Two Analog Temperature Sensor IC’s to its Essential Analog Portfolio

The new ICs reduce design complexity while delivering the high measurement accuracy for systems charged with the protection of cold-chain assets.


Mitsubishi Electric to Launch Second-generation Full-SiC Power Modules for Industrial Use

Mitsubishi Electric to Launch Second-generation Full-SiC Power Modules for Industrial Use

Mitsubishi Electric features its coming launch of second-generation full-SiC (silicon carbide) power modules featuring a newly developed SiC chip…


1200V SiC MOSFET Reduces Space and Increases Efficiency

1200V SiC MOSFET Reduces Space and Increases Efficiency

Mitsubishi Electric announces the addition of the new N-series SiCMOSFETs in a TO-247 package (under development) to the product portfolio in the…


Bel Fuse Announces 0685P Series of Surface Mount Fast-Acting Chip Fuses

Bel Fuse Announces 0685P Series of Surface Mount Fast-Acting Chip Fuses

This article highlights Bel Fuse's 0685P Series of surface mount fast-acting chip fuses with high inrush current withstand capability in a…


Bonding Ribbon for the Next Generation of Power Electronics

Bonding Ribbon for the Next Generation of Power Electronics

he product enables power modules to be designed and manufactured more reliably, efficiently, and cost-effectively.


News Sep 14, 2020 by Hailey Stewart
ON Semi to Sell Japanese Power Fabs

ON Semi to Sell Japanese Power Fabs

Power device giant ON Semiconductor seeks to sell two wafer fabs in Niigata, Japan.


News Sep 13, 2020 by Shannon Cuthrell
Researchers Find Graphene Ribbons Mimic Semiconductor Materials

Researchers Find Graphene Ribbons Mimic Semiconductor Materials

Physicists and chemists from the Swedish Universities of Basel and Bern have produced the first porous graphene ribbons in which specific carbon…