The HybridPACK Drive CoolSiC is a full-bridge module with a 1200-volt blocking voltage aimed at EV traction inverters
The HybridPACK Drive CoolSiC is a full-bridge module with a 1200-volt blocking voltage aimed at EV traction inverters
Leading semiconductor manufacturers and tech giants are pressuring lawmakers to spend $50 billion on the CHIPS for America Act.
Leading semiconductor manufacturers and tech giants are pressuring lawmakers to spend $50 billion on the CHIPS for America Act.
When it comes to designing power converters, wide bandgap (WBG) technologies such as silicon carbide (SiC) are now a…
When it comes to designing power converters, wide bandgap (WBG) technologies such as silicon carbide (SiC) are now a realistic option during…
The AOZ527xQI series from Alpha and Omega Semiconductor (AOS) provides three different DC current levels for optimal…
The AOZ527xQI series from Alpha and Omega Semiconductor (AOS) provides three different DC current levels for optimal multiphase voltage regulation.
Advances in GaN operating voltages have made the wide bandgap technology more relevant than ever to EV manufacturers
Advances in GaN operating voltages have made the wide bandgap technology more relevant than ever to EV manufacturers
Navitas Semiconductor, a GaN power IC provider, is set to go public in a special purpose acquisition company (SPAC) deal…
Navitas Semiconductor, a GaN power IC provider, is set to go public in a special purpose acquisition company (SPAC) deal valued at over $1 billion.
This article highlights United Silicon Carbide FET 650V and 1200V options, all housed in the industry standard D2PAK-7L…
This article highlights United Silicon Carbide FET 650V and 1200V options, all housed in the industry standard D2PAK-7L surface mount package.
Infineon concluded a supply contract with Japanese wafer manufacturer Showa Denko, which offers high-demand silicon…
Infineon concluded a supply contract with Japanese wafer manufacturer Showa Denko, which offers high-demand silicon carbide (SiC) material.
Silicon wafer manufacturer UniversityWafer has announced plans to build a system capable of producing power wideband…
Silicon wafer manufacturer UniversityWafer has announced plans to build a system capable of producing power wideband semiconductor materials in low…
The liquid-cooled modules are ideal for E-Mobility applications and meet the demand for natural cooling in aerospace.
The liquid-cooled modules are ideal for E-Mobility applications and meet the demand for natural cooling in aerospace.
Ferdinand-Braun-Institut (FBH), SweGaN AB, and the University of Bristol are partnering to design and manufacture new…
Ferdinand-Braun-Institut (FBH), SweGaN AB, and the University of Bristol are partnering to design and manufacture new spaceborne devices.
The expanded portfolio of intelligent power modules (IPM) includes two liquid cooled devices
The expanded portfolio of intelligent power modules (IPM) includes two liquid cooled devices
This article highlights Avnet Silica devices featuring STSiC Power components for SiC information.
This article highlights Avnet Silica devices featuring STSiC Power components for SiC information.
The new units are designed to deliver 98% full-load efficiency for applications drawing between 75 and 400 watts
The new units are designed to deliver 98% full-load efficiency for applications drawing between 75 and 400 watts
II-VI establishes its new backend processing line for conductive SiC substrates in Fuzhou, China.
II-VI establishes its new backend processing line for conductive SiC substrates in Fuzhou, China.
Infineon’s Virtual Power Conference, held May 4–6, will feature live expert panels and product demos showcasing the…
Infineon’s Virtual Power Conference, held May 4–6, will feature live expert panels and product demos showcasing the company’s latest energy…
The new components are said to be the first that are both sulfur-resistant and AEC-Q100 compliant
The new components are said to be the first that are both sulfur-resistant and AEC-Q100 compliant
Dutch semiconductor manufacturer Nexperia teams up with China’s United Automotive Electronic Systems Co. on a new…
Dutch semiconductor manufacturer Nexperia teams up with China’s United Automotive Electronic Systems Co. on a new program to develop GaN-based…
This year, Key Foundry’s newly developed Gen3 0.18-micron BCD process and its Gen2 0.13 micron embedded flash process…
This year, Key Foundry’s newly developed Gen3 0.18-micron BCD process and its Gen2 0.13 micron embedded flash process will be used for mass…
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