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High-Density 3D Integrated Silicon Capacitors

High-Density 3D Integrated Silicon Capacitors


News Oct 29, 2015 by Jeff Shepard
Increased Power Density and Performance with 3D Embedded Substrate Technologies

Increased Power Density and Performance with 3D Embedded Substrate Technologies

This article discusses the investigation done by PSMA and offers the important core technologies required for embedding substrates.


Transformer Optimized for IGBT in Infineon EconoDUAL™ 3 Series

Transformer Optimized for IGBT in Infineon EconoDUAL™ 3 Series

45V 1.15mOhm MOSFET with Robust UIS Capability

45V 1.15mOhm MOSFET with Robust UIS Capability

China seeks to accelerate More-than-Moore in Silicon Valley

China seeks to accelerate More-than-Moore in Silicon Valley


News Oct 18, 2015 by Jeff Shepard
Highest Power density by 7th Gen IGBT StdType Module with New TMSTechnology

Highest Power density by 7th Gen IGBT StdType Module with New TMSTechnology

This article highlights Mitsubishi Electric 7th Gen. Std-type IGBT Modules based on TMS-Technology that is the 7th Gen Chip in the T-Series IGBT…


Silicon Carbide gains Traction in Japan

Silicon Carbide gains Traction in Japan


News Oct 08, 2015 by Jeff Shepard
Ascatron gets Funding and Focuses on SiC 150mm Wafers

Ascatron gets Funding and Focuses on SiC 150mm Wafers


News Oct 06, 2015 by Jeff Shepard
High-Temperature Silicon-Controlled Rectifiers

High-Temperature Silicon-Controlled Rectifiers

30V FET for Discharge of Bulk Caps on FPGA Power Rails

30V FET for Discharge of Bulk Caps on FPGA Power Rails

Norstel and Ascatron join forces in SiC Epitaxy

Norstel and Ascatron join forces in SiC Epitaxy


News Oct 05, 2015 by Jeff Shepard
0.9mm-square 100V GaN FET for Wireless Charging

0.9mm-square 100V GaN FET for Wireless Charging

Transistor Arrays with DMOS FET Source-Output Driver

Transistor Arrays with DMOS FET Source-Output Driver

Vertical Organic Semiconductor Crystals

Vertical Organic Semiconductor Crystals


News Oct 04, 2015 by Jeff Shepard
SDK to Offer Low Defect SiC Wafers

SDK to Offer Low Defect SiC Wafers


News Oct 04, 2015 by Jeff Shepard
High Heat Encapsulation for SiC and GaN Power Devices

High Heat Encapsulation for SiC and GaN Power Devices

1.7kV SiC FET for Inverter Auxiliary Power Supplies

1.7kV SiC FET for Inverter Auxiliary Power Supplies

Around the World in 80 Days with GaN Systems

Around the World in 80 Days with GaN Systems

Phileas Fogg, in the classic Jules Verne tale “Around the World in 80 Days”, has an argument in a London club over an 1872 newspaper article which


tech insights Oct 02, 2015 by Jim Witham
IXYS Introduces 12KV X2PT IGBT E3 and SIMBUS F Power Module Series

IXYS Introduces 12KV X2PT IGBT E3 and SIMBUS F Power Module Series

IXYS Corporation announced the release of a new product line of IGBT power modules utilizing the latest X2PT IGBT technology


new products Oct 01, 2015 by IXYS
Making Wireless Power Accessible to the Mass Market

Making Wireless Power Accessible to the Mass Market

This article highlights IDT’s New plug-and-play reference kits enable engineers to integrate wireless charging into product designs in a matter…