This article discusses the performance benefits arising from the use of a low-inductive SMD package with a Kelvin-Source…
This article discusses the performance benefits arising from the use of a low-inductive SMD package with a Kelvin-Source pin for fast SiC MOSFETs.
Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.
Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today…
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced the SIC1182K…
JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power…
JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices
This article examines changing a power module's substrate as a possible option for lowering its semiconductors junction…
This article examines changing a power module's substrate as a possible option for lowering its semiconductors junction temperatures without…
Xilinx Inc. and Infineon Technologies AG are jointly providing scalable power supplies for the Xilinx® Zynq®…
Xilinx Inc. and Infineon Technologies AG are jointly providing scalable power supplies for the Xilinx® Zynq® UltraScale™ + MPSoC and RFSoC…
AgileSwitch India Pvt Ltd was established with a goal to provide Development & Applications Support to customers,…
AgileSwitch India Pvt Ltd was established with a goal to provide Development & Applications Support to customers, particularly in Asia.
Heraeus Electronics, a leading provider of material solutions for the semiconductor industry and electronic packaging…
Heraeus Electronics, a leading provider of material solutions for the semiconductor industry and electronic packaging industry and Toshiba…
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