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Solitron Devices Announces 1200V Silicon Carbide Half Bridge Power Module

Solitron Devices Announces 1200V Silicon Carbide Half Bridge Power Module

The SD11900 series maximizes power density while minimizing loop inductance with a pin configuration to allow simple power bussing.


X-FAB Becomes World’s First Foundry to Offer High-Volume Micro-Transfer Printing

X-FAB Becomes World’s First Foundry to Offer High-Volume Micro-Transfer Printing

X-FAB Semiconductor Foundries announces completion of a licensing agreement with X-Celeprint and becomes world’s first foundry to offer…


News Oct 02, 2021 by Stephanie Leonida
Bulk Capacitor Optimization for Offline Power Supplies Using GaN ICs

Bulk Capacitor Optimization for Offline Power Supplies Using GaN ICs

The adoption of USBPD 3.0 and Type-C connectors is expected to standardize power adaptors across previously segmented electronic markets. Gone are…


Infineon Introduces a Reference Design for a 22kW Motor Driver

Infineon Introduces a Reference Design for a 22kW Motor Driver

The new design is fully customizable and will reduce time to market for a variety of high-power applications.


Central Semiconductor Releases New CAK3 & CAK6 Series 5G Transient Voltage Suppressors

Central Semiconductor Releases New CAK3 & CAK6 Series 5G Transient Voltage Suppressors

Central Semiconductor Corp., introduces its CAK3-012C & CAK6-042C series of 5G bi-directional transient voltage suppressors (TVS).


LeydenJar Receives Financial Boost to Scale Up Silicon Anode Battery Technology

LeydenJar Receives Financial Boost to Scale Up Silicon Anode Battery Technology

LeydenJar Technologies raises €22 million to scale-up production of fast charging silicon anode super batteries.


News Sep 25, 2021 by Stephanie Leonida
Vishay Intertechnology Enhances Thick Film Chip Resistor in 1206 Case Size With Higher 0.5 W Power Rating

Vishay Intertechnology Enhances Thick Film Chip Resistor in 1206 Case Size With Higher 0.5 W Power Rating

AEC-Q200 Qualified Device Saves Board Space While Lowering Component Counts and Placement Costs.


Measuring Conduction Voltage of Semiconductors in Operation for Real Time Temperature Evaluation

Measuring Conduction Voltage of Semiconductors in Operation for Real Time Temperature Evaluation

Junction temperature is directly related to system reliability. With TO packaged transistors, it was possible to add a thermocouple to the case and…


GaN Systems and BMW Group Enter New Semiconductor Capacity Agreement

GaN Systems and BMW Group Enter New Semiconductor Capacity Agreement

The collaboration will see GaN Systems supply BMW Group with high-performance, automotive-grade GaN power transistors.


Tiny Power Management IC from Analog Devices Charges Wearables and Hearables Four Times Faster

Tiny Power Management IC from Analog Devices Charges Wearables and Hearables Four Times Faster

MAX77659 SIMO PMIC with built-in switching charger reduces bill of materials by 60 percent.


Thermally Conductive Foil Used as Thermal Interface Material (TIM) in Power Electronics

Thermally Conductive Foil Used as Thermal Interface Material (TIM) in Power Electronics

The omnipresent trend in Power Electronics for higher performances at smaller space require a quick, effective and cost-efficient heat-transfer…


VIsIC Technologies Raise Funds for GaN-based Automotive Applications

VIsIC Technologies Raise Funds for GaN-based Automotive Applications

ViSIC Technologies received $35 million in funding to expand its GaN-based product range for automotive applications.


News Sep 20, 2021 by Stephanie Leonida
Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready

Reduce Switching Losses up to 50% While Accelerating Time to Market with the First Fully Configurable Digital Gate Driver for Silicon Carbide MOSFETs – Now Production Ready

New technology enables electric buses and other e-transportation power systems to meet and exceed stringent environmental conditions while…


Vishay’s RCV-AT Series of Film Chip Resistors Save Board Space, Lower Component Counts

Vishay’s RCV-AT Series of Film Chip Resistors Save Board Space, Lower Component Counts

Vishay Intertechnology introduces a new series of AEC-Q200 qualified thick film chip resistors with operating voltages up to 3 kV in the 2010 and…


Silicon Designs Announces Immediate Availability of MEMS Capacitive Accelerometer Chips

Silicon Designs Announces Immediate Availability of MEMS Capacitive Accelerometer Chips

Silicon Designs, Inc., today announced that three of its industry best-selling industrial-grade surface mount MEMS capacitive accelerometer chip…


Nexperia’s Power Live Conference Begins This Week

Nexperia’s Power Live Conference Begins This Week

Nexperia announces the commencement of its virtual, power electronics-focused Power Live conference.


News Sep 19, 2021 by Stephanie Leonida
Infineon Unveils New Current Ratings for its 1200V EconoDUAL 3 Portfolio

Infineon Unveils New Current Ratings for its 1200V EconoDUAL 3 Portfolio

Based on the Infineon’s TRENCHSTOP IGBT 7 chips, the company adds 450A, 600A, and 750A versions to its popular family of power modules.


AVX Launches New TCO Series High-Temperature, Automotive-Grade Polymer Chip Capacitors

AVX Launches New TCO Series High-Temperature, Automotive-Grade Polymer Chip Capacitors

TCO Series capacitors meet AEC-Q200 requirements, exhibit low DCL and a benign failure mode, and are ideal for use in low- and medium-power…


Würth Elektronik Extends its MagI³C-FDSM-36-V Family with a 12V Output Voltage Version

Würth Elektronik Extends its MagI³C-FDSM-36-V Family with a 12V Output Voltage Version

Power Modules Replace L78x Linear Regulators.


Onsemi, Renesas and Analog Devices all Announce and Finalize Acquisitions

Onsemi, Renesas and Analog Devices all Announce and Finalize Acquisitions

A number of power electronics groups have recently announced new acquisitions.