UnitedSiC expands its UF3C FAST Series product offering by introducing an additional range of 650 V and 1200 V high-performance silicon carbide FETs
UnitedSiC expands its UF3C FAST Series product offering by introducing an additional range of 650 V and 1200 V high-performance silicon carbide FETs
GaN High Electron Mobility Transistors (GaN HEMT) have a lower driving loss and shorter deadtime circuit benefits due…
GaN High Electron Mobility Transistors (GaN HEMT) have a lower driving loss and shorter deadtime circuit benefits due to significantly…
Ironwood Electronics recently introduced a new stamped spring pin socket addressing high-performance requirements for…
Ironwood Electronics recently introduced a new stamped spring pin socket addressing high-performance requirements for testing BGA1089 - CBT-BGA-6082.
This article highlights PREMO Group launched the 3DPower™ as the first product to integrate two magnetic components…
This article highlights PREMO Group launched the 3DPower™ as the first product to integrate two magnetic components that share the same core.
Power management company Eaton recently announced its next generation of miniature power inductors. The MPI25V2 and…
Power management company Eaton recently announced its next generation of miniature power inductors. The MPI25V2 and MPIA25V2 represent many of…
Wide bandgap GaN and SiC devices are expected to experience high levels of growth in applications ranging from power…
Wide bandgap GaN and SiC devices are expected to experience high levels of growth in applications ranging from power conversion to RF transistors…
Power Integrations announces the release of its BridgeSwitch™ integrated half-bridge (IHB) motor driver IC family.
Power Integrations announces the release of its BridgeSwitch™ integrated half-bridge (IHB) motor driver IC family.
This article highlights TDK Corporation ceramic EPCOS inrush current limiters (ICLs), based on NTC and PTC thermistors…
This article highlights TDK Corporation ceramic EPCOS inrush current limiters (ICLs), based on NTC and PTC thermistors as strong duo used in…
This article highlights Hitachi Europe, Ltd. introduction of nHPD2 Power Modules as the first high-voltage IGBT-based…
This article highlights Hitachi Europe, Ltd. introduction of nHPD2 Power Modules as the first high-voltage IGBT-based power module for traction, etc..
This article highlights KEMET Multi-Layer Ceramic Chip Capacitors rated for operation up to 200°C, featuring C0G…
This article highlights KEMET Multi-Layer Ceramic Chip Capacitors rated for operation up to 200°C, featuring C0G dielectric and nickel…
This article features Indium Corporation reinforced solder preforms that improve the reliability of solder joints with…
This article features Indium Corporation reinforced solder preforms that improve the reliability of solder joints with consistent solder joint…
This article highlights Danfoss Silicon Power DCM Power Modules as the next generation technology platform for automotive…
This article highlights Danfoss Silicon Power DCM Power Modules as the next generation technology platform for automotive traction inverters.
This article answers the question as to how to design capacitors for harsh environment applications.
This article answers the question as to how to design capacitors for harsh environment applications.
Facebook
Google
GitHub
Linkedin