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New Power-Supply Transformers Complement Power Integrations SCALEiDriver GateDriver IC Family

New Power-Supply Transformers Complement Power Integrations SCALEiDriver GateDriver IC Family

Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced a range of…

new products Mar 05, 2019 by Power Integrations
40V Three-Phase Sensorless Sinusoidal Fan Driver IC Minimizes Vibration & Noise

40V Three-Phase Sensorless Sinusoidal Fan Driver IC Minimizes Vibration & Noise

new products Mar 01, 2019 by Scott McMahan
Hans Keller joins Höganäs as new President for Product Area Surface and Joining Technologies

Hans Keller joins Höganäs as new President for Product Area Surface and Joining Technologies

Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.

new products Mar 01, 2019 by Hoganas
JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

JEDEC Wide Bandgap Power Semiconductor Committee Publishes First Document Test Method for Dynamic Resistance of GaN HEMT

 JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices

new products Mar 01, 2019 by JEDEC
Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

Single-Chip Wireless IoT Solution Improves Battery Life by Over 50%

new products Feb 25, 2019 by Scott McMahan
ASIL-D Real-Time Automotive MCUs with 40MB of On-Chip Memory

ASIL-D Real-Time Automotive MCUs with 40MB of On-Chip Memory

new products Feb 21, 2019 by Scott McMahan
ROHM Announces New HighReliability 1608Size White Chip LED

ROHM Announces New HighReliability 1608Size White Chip LED

ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves class-leading reliability. This…

new products Feb 21, 2019 by ROHM
H-Bridge Driver IC with Integrated Arm Cortex M0 for Automotive

H-Bridge Driver IC with Integrated Arm Cortex M0 for Automotive

new products Feb 20, 2019 by Paul Shepard
3.0kW Single-Phase Inverter GaN Evaluation Platform

3.0kW Single-Phase Inverter GaN Evaluation Platform

new products Feb 15, 2019 by Paul Shepard
Vicor Introduces Four New Tightly Regulated DC-DC Converter ChiP Modules

Vicor Introduces Four New Tightly Regulated DC-DC Converter ChiP Modules

The new entries in the extensive DCM™ family are available in the 3623(36 x 23mm) ChiP (Converter housed in Package™) with an unrivaled power…

new products Feb 14, 2019 by Vicor
STMicroelectronics to Acquire Majority Stake in Silicon Carbide Wafer Manufacturer Norstel AB

STMicroelectronics to Acquire Majority Stake in Silicon Carbide Wafer Manufacturer Norstel AB

STMicroelectronics, a global semiconductor leader serving customers across the spectrum of electronics applications, today announced it has signed…

new products Feb 13, 2019 by STMicroelectronics
40Vds GaN FETs in 20-Amp Half-Bridge Development Board

40Vds GaN FETs in 20-Amp Half-Bridge Development Board

new products Feb 07, 2019 by Paul Shepard
ECPE Announces the Final Program for SiC and GaN User Forum Potential of Wide Bandgap Semiconductors in Power Electronic Applications

ECPE Announces the Final Program for SiC and GaN User Forum Potential of Wide Bandgap Semiconductors in Power Electronic Applications

ECPE is pleased to present the final program for the ECPE Workshop 'SiC & GaN User Forum: Potential of Wide Bandgap Semiconductors in…

new products Feb 07, 2019 by ECPE
Alpha and Omega Semiconductor Continues to Expand its Fifth Generation EZBuck Family

Alpha and Omega Semiconductor Continues to Expand its Fifth Generation EZBuck Family

Alpha and Omega Semiconductor Limited (AOS) today introduced  AOZ6662DI-01 and AOZ6663DI-01, high efficiency, simple-to-use synchronous buck…

new products Feb 07, 2019 by Alpha and Omega Semiconductor
3.3µF to 680µF Polymer Tantalum Molded Chip Capacitors Now in Z Case

3.3µF to 680µF Polymer Tantalum Molded Chip Capacitors Now in Z Case

new products Feb 06, 2019 by Scott McMahan
IWIPP 2019 to Address Wide Bandgap Semiconductor Power Packaging Challenges

IWIPP 2019 to Address Wide Bandgap Semiconductor Power Packaging Challenges

The International Workshop on Integrated Power Packaging announces IWIPP 2019, to be held in Toulouse, France, April 24-26, 2019.

new products Feb 06, 2019 by IWIPP
2500W Full-Bridge Totem-Pole PFC Demo Board using GaN Power Switches

2500W Full-Bridge Totem-Pole PFC Demo Board using GaN Power Switches

new products Feb 04, 2019 by Paul Shepard
AEC-Q100 DC Motor H-Bridge Driver IC with LIN Communications

AEC-Q100 DC Motor H-Bridge Driver IC with LIN Communications

new products Feb 01, 2019 by Scott McMahan
GaN-on-Si 10W Fully-matched, Two-stage PA Features 40% Efficiency

GaN-on-Si 10W Fully-matched, Two-stage PA Features 40% Efficiency

new products Jan 23, 2019 by Scott McMahan
80Vds to 100Vds GaN FETs Gain AEC-Q101 Qualification

80Vds to 100Vds GaN FETs Gain AEC-Q101 Qualification

new products Jan 18, 2019 by Scott McMahan