Anaheim, Calif., Applied Power Electronics Conference & Exposition (APEC) March 19, 2019 – GaN Systems, the global leader in GaN (gallium…
Anaheim, Calif., Applied Power Electronics Conference & Exposition (APEC) March 19, 2019 – GaN Systems, the global leader in GaN (gallium…
GaN Systems announces a strategic partnership with Aveox to significantly reduce the size and weight of their 3-phase AC…
GaN Systems announces a strategic partnership with Aveox to significantly reduce the size and weight of their 3-phase AC power converters with APFC.
Silanna Semiconductor recently unveiled the world’s first fully integrated active clamp flyback (ACF) controller for…
Silanna Semiconductor recently unveiled the world’s first fully integrated active clamp flyback (ACF) controller for designing high-power-density…
This article features ON Semiconductor Strata Developer Studio™ development platform that facilitates the rapid and…
This article features ON Semiconductor Strata Developer Studio™ development platform that facilitates the rapid and easy evaluation of solutions.
Transphorm Inc.—the leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101…
Transphorm Inc.—the leader in the design and manufacturing of the highest reliability and first JEDEC- and AEC-Q101 qualified 650 V gallium…
GaN Systems announced the availability of the GS-065 low current transistor line.
GaN Systems announced the availability of the GS-065 low current transistor line.
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today…
Power Integrations, the leader in gate-driver technology for medium- and high-voltage inverter applications, today announced a range of…
Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.
Hans Keller joins Höganäs as President Product Area Surface & Joining Technologies on 1 March 2019.
JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power…
JEDEC announces the publication of JEP173: Dynamic On-Resistance Test Method Guidelines for GaN HEMT Based Power Conversion Devices
ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves…
ROHM today announced the availability of the SMLD12WBN1W, a White chip LED with 1608 (1.6x0.8mm) size that achieves class-leading reliability. This…
The new entries in the extensive DCM™ family are available in the 3623(36 x 23mm) ChiP (Converter housed in Package™)…
The new entries in the extensive DCM™ family are available in the 3623(36 x 23mm) ChiP (Converter housed in Package™) with an unrivaled power…