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Toshiba Launches Dual MOSFET for Mobile Device Charging

Toshiba Launches Dual MOSFET for Mobile Device Charging

650V SiC Diodes from STMicro Offered in Unique Dual Configurations

650V SiC Diodes from STMicro Offered in Unique Dual Configurations

Automotive-Grade Solid Ta Chip Capacitors in Small Case Sizes Down to 0603

Automotive-Grade Solid Ta Chip Capacitors in Small Case Sizes Down to 0603

Dual Photovoltaic MOSFET Driver Replaces Discrete Solutions and Increases Drive Power

Dual Photovoltaic MOSFET Driver Replaces Discrete Solutions and Increases Drive Power

Highly-Integrated 225 Degrees C Isolated Gate Driver for SiC Power Switches

Highly-Integrated 225 Degrees C Isolated Gate Driver for SiC Power Switches

85V Half-Bridge MOSFET Driver with Adaptive Dead Time and Shoot-Through Protection

85V Half-Bridge MOSFET Driver with Adaptive Dead Time and Shoot-Through Protection

P-Channel Gen III MOSFET Features 0.0016-Ohm On-resistance

P-Channel Gen III MOSFET Features 0.0016-Ohm On-resistance

IDT Claims Industry’s First Single-chip 5V Wireless Power Transmitter Solution

IDT Claims Industry’s First Single-chip 5V Wireless Power Transmitter Solution

RFaxis Unveils Advanced Envelope Tracker for CMOS Power Amplifiers

RFaxis Unveils Advanced Envelope Tracker for CMOS Power Amplifiers

IdealPoE Diode Bridge Integrates Low-Loss MOSFET Base Bridges and Controller

IdealPoE Diode Bridge Integrates Low-Loss MOSFET Base Bridges and Controller

50 Most-Read New Product Stories of 2013: 20 to 11

50 Most-Read New Product Stories of 2013: 20 to 11

50 Most-Read New Product Stories of 2013: 30 to 21

50 Most-Read New Product Stories of 2013: 30 to 21

50 Most-Read New Product Stories of 2013: 50 to 41

50 Most-Read New Product Stories of 2013: 50 to 41

Mitsubishi to Launch Railcar Traction Inverter with All-SiC Power Module

Mitsubishi to Launch Railcar Traction Inverter with All-SiC Power Module

Fourth-Gen HV Amplifier IC offered in Single- and Dual-Channel Designs

Fourth-Gen HV Amplifier IC offered in Single- and Dual-Channel Designs

High-Temperature SiC Junction Transistors in Hermetic Packages

High-Temperature SiC Junction Transistors in Hermetic Packages

Stackpole Claims Lowest Heat Rise In A 2512 Size Chip Resistor

Stackpole Claims Lowest Heat Rise In A 2512 Size Chip Resistor

Solderable and Sinterable Top-Side Bonding for High-Power IGBT Wafers

Solderable and Sinterable Top-Side Bonding for High-Power IGBT Wafers

Asymmetric Package Optimizes Low-Side MOSFET RDS(on) for Synchronous DC-DCs

Asymmetric Package Optimizes Low-Side MOSFET RDS(on) for Synchronous DC-DCs

Envelope Tracker Boosts Efficiency of CMOS Power Amplifiers in Smartphones

Envelope Tracker Boosts Efficiency of CMOS Power Amplifiers in Smartphones