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New Accu-L Series Thin Film Chip Inductors for Automotive Signal and Power Applications Released

New Accu-L Series Thin Film Chip Inductors for Automotive Signal and Power Applications Released

AVX Corporation has released a new series of thin-film multilayer chip inductors especially designed to meet demanding performance specifications…


new products Jan 23, 2018 by AVX
Thin-Film Chip Inductors for Automotive Signal & Power

Thin-Film Chip Inductors for Automotive Signal & Power

Ultra-Low Power Consumption Voltage Detection IC with MOSFET

Ultra-Low Power Consumption Voltage Detection IC with MOSFET

Ultra-Low-Power Battery Protection IC for Wearables and Small IoT Devices

Ultra-Low-Power Battery Protection IC for Wearables and Small IoT Devices

1200V SiC Schottky Diodes Rated for 8A, 15A and 20A

1200V SiC Schottky Diodes Rated for 8A, 15A and 20A

Expanded SiC Schottky Diode Line Reduces Switching Losses Increases Efficiency and Robustness

Expanded SiC Schottky Diode Line Reduces Switching Losses Increases Efficiency and Robustness

Littelfuse, Inc. introduced four new series of 1200V silicon carbide (SiC) Schottky Diodes from its GEN2 product family


new products Jan 16, 2018 by Littelfuse
GaN enables Ultra Wide-Band Linearized Doherty Amplifier

GaN enables Ultra Wide-Band Linearized Doherty Amplifier

Next Generation Silicon Carbide Power Device with 3DSiC Technology

Next Generation Silicon Carbide Power Device with 3DSiC Technology

Ascatron provides next generation Silicon Carbide (SiC) power semiconductors using its proprietary 3DSiC® technology with a quality and…


new products Jan 11, 2018 by Ascatron
NPC Modules with Latest IGBT Chip Tech for up to 120kVA

NPC Modules with Latest IGBT Chip Tech for up to 120kVA

High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC

High-Voltage Multi-Channel Solenoid and Unipolar Motor Driver IC

Toshiba Electronics Europe (TEE) announced the launch of a multi-channel solenoid and unipolar motor driver IC (TB67S111PG) that delivers…


Energous & Dialog Unveil Wireless Charging 2.0 IC

Energous & Dialog Unveil Wireless Charging 2.0 IC

Buck-Converter with Record Step-Down Ratio

Buck-Converter with Record Step-Down Ratio

This article highlights the ROHM Semiconductor's BD9V100MUF-C, a DC/DC converter that has both high conversion ratio and high switching…


new products Jan 05, 2018 by ROHM
Axial-lead Hybrid Polymer AI Caps with Highest Current Ratings

Axial-lead Hybrid Polymer AI Caps with Highest Current Ratings

This article highlights the features of the TDK Electronics' new hybrid aluminium electrolytic capacitors which offers a significant reduction…


Secondary-Side Synchronous Rectification Driver for High-Efficiency SMPS

Secondary-Side Synchronous Rectification Driver for High-Efficiency SMPS

Three-Phase MOSFET Driver IC with On-Board Regulator

Three-Phase MOSFET Driver IC with On-Board Regulator

Half-Bridge Reference Design for Evaluating Si, SiC and GaN Power Devices

Half-Bridge Reference Design for Evaluating Si, SiC and GaN Power Devices

40V GaN Power Transistor is 8X Smaller than Equivalently-Rated MOSFETS

40V GaN Power Transistor is 8X Smaller than Equivalently-Rated MOSFETS

Single-Chip Balun for sub-1GHz Radio Reduces Board Space by 96%

Single-Chip Balun for sub-1GHz Radio Reduces Board Space by 96%

Give the Gift of GaN Class-D Audio

Give the Gift of GaN Class-D Audio

High Density Power Amplifier IC Delivers New Levels of Performance

High Density Power Amplifier IC Delivers New Levels of Performance

This article features the Apex Microtechnology's PA164 and PA165 enhancements and benefits in power amplifier performance.