Infineon Technologies AG introduces the package technology TRENCHSTOP™ Advanced Isolation available for TRENCHSTOP and…
Infineon Technologies AG introduces the package technology TRENCHSTOP™ Advanced Isolation available for TRENCHSTOP and TRENCHSTOP Highspeed 3 IGBTs.
Infineon Technologies AG introduces the fifth generation of the stand-alone quasi-resonant flyback controller and…
Infineon Technologies AG introduces the fifth generation of the stand-alone quasi-resonant flyback controller and integrated power IC CoolSET™…
Premier Magnetics introduces its line of low-cost, high-performance drum core inductors designed for EMI filtering and…
Premier Magnetics introduces its line of low-cost, high-performance drum core inductors designed for EMI filtering and switch mode power supply…
Transphorm Inc. announced that its second generation, JEDEC-qualified high voltage gallium nitride (GaN) technology is…
Transphorm Inc. announced that its second generation, JEDEC-qualified high voltage gallium nitride (GaN) technology is now the industry’s first…
Alpha and Omega Semiconductor Limited introduced the AOZ1375, AOS’s first Type-C Power Delivery full-compliant power…
Alpha and Omega Semiconductor Limited introduced the AOZ1375, AOS’s first Type-C Power Delivery full-compliant power protection switch.
A Digitally Enhanced Power Analog product for DC-DC power conversion is now available from Microchip Technology Inc.
A Digitally Enhanced Power Analog product for DC-DC power conversion is now available from Microchip Technology Inc.
Littelfuse, Inc., the global leader in circuit protection, today introduced the first encapsulated surface mount fuse…
Littelfuse, Inc., the global leader in circuit protection, today introduced the first encapsulated surface mount fuse designed for intrinsic safety…
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