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3W 2817-Size Ceramic Chip Resistors Support 1A to 30A Designs

3W 2817-Size Ceramic Chip Resistors Support 1A to 30A Designs

new products Aug 21, 2017 by Paul Shepard
DC-DC Converters for Driving Next-Gen SiC MOSFETs

DC-DC Converters for Driving Next-Gen SiC MOSFETs

new products Aug 17, 2017 by Paul Shepard
Microsemi to Develop 1.7kV and 3.3kV SiC FETS and Diodes for PowerAmerica

Microsemi to Develop 1.7kV and 3.3kV SiC FETS and Diodes for PowerAmerica

News Aug 17, 2017 by Paul Shepard
High-Purity Silicon Carbide Technology Platform for SiC Power Devices

High-Purity Silicon Carbide Technology Platform for SiC Power Devices

News Aug 16, 2017 by Paul Shepard
Electric Power Research Institute Funds GRAPES SiC Project

Electric Power Research Institute Funds GRAPES SiC Project

News Aug 15, 2017 by Paul Shepard
Current Sensor IC with Dual User-Settable Over-Current Fault Outputs

Current Sensor IC with Dual User-Settable Over-Current Fault Outputs

new products Aug 14, 2017 by Paul Shepard
80 Titanium Efficiency Rating in Next-Generation Telecom and Data Center Applications Enabled by New SiC MOSFET

80 Titanium Efficiency Rating in Next-Generation Telecom and Data Center Applications Enabled by New SiC MOSFET

Wolfspeed, A Cree Company announces that it has advanced the development of high efficiency data center power supplies through the implementation…

new products Aug 11, 2017 by Wolfspeed
Dual-Transistor GaN-on-SiC Amplifier Lowers Telecom Infrastructure Costs

Dual-Transistor GaN-on-SiC Amplifier Lowers Telecom Infrastructure Costs

new products Aug 10, 2017 by Paul Shepard
SiC MOSFETs Enable 80+ Titanium Efficiency in Data Center Power

SiC MOSFETs Enable 80+ Titanium Efficiency in Data Center Power

News Aug 10, 2017 by Paul Shepard
II-VI Inc. Acquires 6-inch GaN/SiC/InP Wafer Fab in U.K.

II-VI Inc. Acquires 6-inch GaN/SiC/InP Wafer Fab in U.K.

News Aug 07, 2017 by Paul Shepard
RF MLCCs Rated to +200 C Target SiC and GaN Designs

RF MLCCs Rated to +200 C Target SiC and GaN Designs

new products Aug 07, 2017 by Paul Shepard
Cesium-Tin-Oxide Wires - A Semiconductor That Blocks Heat Transfer

Cesium-Tin-Oxide Wires - A Semiconductor That Blocks Heat Transfer

News Aug 07, 2017 by Paul Shepard
Showa Denko Acquires Assets Related to SiC for Power Devices

Showa Denko Acquires Assets Related to SiC for Power Devices

News Aug 06, 2017 by Paul Shepard
Side Wall Gate - Moving on from Trench

Side Wall Gate - Moving on from Trench

This article discusses the new side wall gate structure and its performance characteristics and its module-level investigation.

Technical Articles Aug 02, 2017 by Neil Markham
2-to-3-Cell Ultra-Small Li-Ion Battery Protection IC

2-to-3-Cell Ultra-Small Li-Ion Battery Protection IC

new products Jul 31, 2017 by Paul Shepard
MEMS Capacitive Accelerometer and LCCJCC Chip Offerings Expanded for Automotive Testing

MEMS Capacitive Accelerometer and LCCJCC Chip Offerings Expanded for Automotive Testing

The 100% veteran owned and U.S.-based Silicon Designs, Inc. industry experts in the design, development and manufacture of highly rugged…

new products Jul 26, 2017 by Silicon Designs
0805-Sized Ceramic Chip Inductors Provide Highest Q

0805-Sized Ceramic Chip Inductors Provide Highest Q

new products Jul 25, 2017 by Paul Shepard
PFC+LLC Resonance Control IC Reduces Standby Power

PFC+LLC Resonance Control IC Reduces Standby Power

new products Jul 21, 2017 by Paul Shepard
Next-Generation SiC Platform for 6-inch Wafers

Next-Generation SiC Platform for 6-inch Wafers

News Jul 20, 2017 by Paul Shepard
Creating Many Thin Layers from a Single GaN Wafer

Creating Many Thin Layers from a Single GaN Wafer

News Jul 14, 2017 by Paul Shepard