New Industry Products

Suppress Noise in Power Circuits with High-Impedance Chip Beads

August 28, 2017 by Paul Shepard

TDK Corporation announced the development of the MMZ0402EUC series of chip beads, claiming the lowest dc resistance for chip beads of this size. The two new types with their respective impedance values of 150Ω and 180Ω at 100MHz, feature dc resistance values of only 0.62Ω and 0.69Ω.

This results in a significant reduction in power losses, while at the same time providing excellent noise suppression. In fact, the compact IEC 0402 components with dimensions of 0.4mm x 0.2mm x 0.2mm feature an impedance that is up to 20 percent higher than TDK's existing MMZ chip beads with the same dc resistance rating.

Combined with their higher rated currents of 350mA and 300mA compared to existing types, the new MMZ0402EUC chip beads are suited for noise suppression in the power and signal circuits of smartphones, tablets and other mobile devices. Mass production was launched in August 2017.

The improved ratio of impedance to dc resistance of the new series was achieved thanks to advanced TDK materials. The components can be used in a wide range of temperatures from -55 to +125 °C. TDK will continue to expand the available range of impedance values in the compact lineup to meet the requirements for a broad range of mobile device designs.

Main features and benefits:

  • Lowest dc resistance for a chip bead of its size, with values as low as 0.62Ω
  • Impedance of 150Ω and 180Ω at 100MHz is up to 20 percent higher than that of existing chip beads with the same dc resistance
  • Compact dimensions of just 0.4 mm x 0.2 mm x 0.2 mm
  • Wide operating temperature range from -55 to +125 °C