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Stepping Motor Driver IC has an Anti-Stall Feedback Architecture

Stepping Motor Driver IC has an Anti-Stall Feedback Architecture

new products Sep 12, 2017 by Paul Shepard
Three-Axis Linear Hall-Effect Sensor IC Alternative to Potentiometers

Three-Axis Linear Hall-Effect Sensor IC Alternative to Potentiometers

new products Sep 12, 2017 by Paul Shepard
New 1200V 40A H1 IGBT Optimized for High Switching Frequency Applications Announced

New 1200V 40A H1 IGBT Optimized for High Switching Frequency Applications Announced

Alpha and Omega Semiconductor Ltd. expands its recently launched fast turn-off switched 650V H-series IGBT family with a 1200V rating

new products Sep 12, 2017 by Alpha and Omega Semiconductor
Newly-Discovered Semiconductor Dynamics May Help Improve Energy Efficiency

Newly-Discovered Semiconductor Dynamics May Help Improve Energy Efficiency

News Sep 11, 2017 by Paul Shepard
Signing Seals Compound Semiconductor Cluster in South-East Wales

Signing Seals Compound Semiconductor Cluster in South-East Wales

News Sep 11, 2017 by Paul Shepard
1200-Volt SiC Schottkys for High-Temperature Designs

1200-Volt SiC Schottkys for High-Temperature Designs

new products Sep 08, 2017 by Paul Shepard
SiC Power Modules for a Wide Application Range Innovative Power Devices for a Sustainable Future

SiC Power Modules for a Wide Application Range Innovative Power Devices for a Sustainable Future

This article explains in detail the innovation potential and benefits of integrating SiC-technology in power electronics systems.

Technical Articles Sep 08, 2017 by Junji Yamada
IEEE Rates Peregrine Semiconductor as a Leader in “Patent Power”

IEEE Rates Peregrine Semiconductor as a Leader in “Patent Power”

News Sep 07, 2017 by Paul Shepard
High-Current 4-Channel H-bridge Motor Driver IC is 0.9mm High

High-Current 4-Channel H-bridge Motor Driver IC is 0.9mm High

new products Sep 07, 2017 by Paul Shepard
COLD SPLIT Provides Significant Cost Advantages for SiC Substrates and Devices

COLD SPLIT Provides Significant Cost Advantages for SiC Substrates and Devices

This article highlights Siltectra's Cold Split, a kerf-free wafering technique, and discusses its advantages over conventional techniques.

Technical Articles Sep 04, 2017 by Jan Richter
Compound Semiconductor Applications Catapult appoints CEO

Compound Semiconductor Applications Catapult appoints CEO

News Sep 02, 2017 by Paul Shepard
Pressureless Sinter Joining for Next-Gen GaN & SiC Power Semis

Pressureless Sinter Joining for Next-Gen GaN & SiC Power Semis

News Sep 01, 2017 by Paul Shepard
Economical High Resistance Chip Resistors

Economical High Resistance Chip Resistors

new products Aug 31, 2017 by Paul Shepard
S3semi sets Custom Mixed-Signal IC Strategy for Industrial Systems

S3semi sets Custom Mixed-Signal IC Strategy for Industrial Systems

News Aug 30, 2017 by Paul Shepard
ROHM now Offering SiC, IGBTs and Gate Drivers in India

ROHM now Offering SiC, IGBTs and Gate Drivers in India

News Aug 30, 2017 by Paul Shepard
Suppress Noise in Power Circuits with High-Impedance Chip Beads

Suppress Noise in Power Circuits with High-Impedance Chip Beads

new products Aug 28, 2017 by Paul Shepard
250W 50V GaN HEMT with High Efficiency to 3.0GHz

250W 50V GaN HEMT with High Efficiency to 3.0GHz

new products Aug 24, 2017 by Paul Shepard
SII Semiconductor Changes Name to ABLIC Inc.

SII Semiconductor Changes Name to ABLIC Inc.

News Aug 24, 2017 by Paul Shepard
50V GaN HEMT Family Released with a High Efficiency 30GHz 250W Device

50V GaN HEMT Family Released with a High Efficiency 30GHz 250W Device

Wolfspeed has extended its family of 50V unmatched GaN HEMT RF power devices.

new products Aug 24, 2017 by Wolfspeed
Brite Semi and SaberTek Partner on Smart Utility Network Wireless Chip

Brite Semi and SaberTek Partner on Smart Utility Network Wireless Chip

News Aug 23, 2017 by Paul Shepard